Jürgen Wilde

According to our database, Jürgen Wilde authored at least 6 papers between 2001 and 2016.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2016

Reliability modeling of Sn-Ag transient liquid phase die-bonds for high-power SiC devices.

Adeel Ahmad Bajwa, Jürgen Wilde

Microelectron. Reliab., 2016

2014

Influence of dicing damages on the thermo-mechanical reliability of bare-chip assemblies.

Matthias Steiert, Jürgen Wilde

Microelectron. Reliab., 2014

2012

Harsh environment application of electronics - Reliability of copper wiring and testability thereof.

Sabrina Rathgeber, R. Bauer, Andreas Otto, Erik Peter, Jürgen Wilde

Microelectron. Reliab., 2012

2008

Low-cost preparation method for exposing IC surfaces in stacked die packages by micro-abrasive blasting.

Stefan Martens, B. Krueger, Walter Mack, Friedemann Voelklein, Jürgen Wilde

Microelectron. Reliab., 2008

2003

Design optimization of an eddy current sensor using the finite-elements method.

Jürgen Wilde, Yuqing Lai

Microelectron. Reliab., 2003

2001

Reliability of Chip/DCB Solder Joints in AlSiC Base Plate Power Modules: Influence of Chip Size.

Markus Thoben, X. Xie, D. Silber, Jürgen Wilde

Microelectron. Reliab., 2001