Junichiro Kadomoto

Orcid: 0000-0002-8973-0864

According to our database1, Junichiro Kadomoto authored at least 42 papers between 2015 and 2024.

Collaborative distances:

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Bibliography

2024
Cycle-Oriented Dynamic Approximation: Architectural Framework to Meet Performance Requirements.
IEEE Comput. Archit. Lett., 2024

DataPipettor: Touch-Based Information Transfer Interface Using Proximity Wireless Communication.
Proceedings of the Adjunct Proceedings of the 37th Annual ACM Symposium on User Interface Software and Technology, 2024

Preliminary Design Space Exploration for ASIC Implementation of Control Systems in Fault-Tolerant Quantum Computers.
Proceedings of the IEEE International Conference on Quantum Computing and Engineering, 2024

CommuTiles: Shape-Changeable Modular Computer System Using Proximity Wireless Communication.
Proceedings of the Extended Abstracts of the CHI Conference on Human Factors in Computing Systems, 2024

Multi-Tree Network Protocol Enabling System Partitioning for Shape-Changeable Computer System.
Proceedings of the 21st ACM International Conference on Computing Frontiers, 2024

2023
FPGA-based Garbling Accelerator with Parallel Pipeline Processing.
IEICE Trans. Inf. Syst., December, 2023

A Principal Factor of Performance in Decoupled Front-End.
IEICE Trans. Inf. Syst., December, 2023

Dynamically Reconfigurable Network Protocol for Shape-Changeable Computer System.
IEEE Des. Test, December, 2023

iKnowde: Interactive Learning Path Generation System Based on Knowledge Dependency Graphs.
Proceedings of the Adjunct Proceedings of the 36th Annual ACM Symposium on User Interface Software and Technology, 2023

A Functional Reactive Programming Language for Wirelessly Connected Shape-Changeable Chiplet-Based Computers.
Proceedings of the Companion Proceedings of the 2023 ACM SIGPLAN International Conference on Systems, 2023

Poster Abstract: Towards a Tiny Digital Displacement Sensor Utilizing Bit-Error Characteristics of Inter-Chip Wireless Bus.
Proceedings of the 21st ACM Conference on Embedded Networked Sensor Systems, 2023

Poster Abstract: Investigation of Distance Sensing Method Using Magnetic Resonant Coupled Coils for Deformable User Interfaces.
Proceedings of the 21st ACM Conference on Embedded Networked Sensor Systems, 2023

Clockhands: Rename-free Instruction Set Architecture for Out-of-order Processors.
Proceedings of the 56th Annual IEEE/ACM International Symposium on Microarchitecture, 2023

An Out-of-Order Superscalar Processor Using STRAIGHT Architecture in 28 nm CMOS.
Proceedings of the IEEE International Symposium on Circuits and Systems, 2023

2022
Evaluation of Different Microarchitectures for Energy-Efficient RISC-V Cores.
Proceedings of the 15th IEEE International Symposium on Embedded Multicore/Many-core Systems-on-Chip, 2022

Deformable Chiplet-Based Computer Using Inductively Coupled Wireless Communication.
Proceedings of the 27th Asia and South Pacific Design Automation Conference, 2022

2021
Toward Wirelessly Cooperated Shape-Changing Computing Particles.
IEEE Pervasive Comput., 2021

Multiport Register File Design for High-Performance Embedded Cores.
Proceedings of the 14th IEEE International Symposium on Embedded Multicore/Many-core Systems-on-Chip, 2021

Accurate and Fast Performance Modeling of Processors with Decoupled Front-end.
Proceedings of the 39th IEEE International Conference on Computer Design, 2021

Compiling and Optimizing Real-world Programs for STRAIGHT ISA.
Proceedings of the 39th IEEE International Conference on Computer Design, 2021

2020
Design of Shape-Changeable Chiplet-Based Computers Using an Inductively Coupled Wireless Bus Interface.
Proceedings of the 38th IEEE International Conference on Computer Design, 2020

A High-Performance Out-of-Order Soft Processor Without Register Renaming.
Proceedings of the 30th International Conference on Field-Programmable Logic and Applications, 2020

A RISC-V Processor with an Inter-Chiplet Wireless Communication Interface for Shape-Changeable Computers.
Proceedings of the 2020 IEEE Symposium in Low-Power and High-Speed Chips, 2020

A Self-Sensing Technique Using Inductively-Coupled Coils for Deformable User Interfaces.
Proceedings of the AsianCHI '20: Proceedings of the 2020 Symposium on Emerging Research from Asia and on Asian Contexts and Cultures, 2020

An Inductively Coupled Wireless Bus for Chiplet-Based Systems.
Proceedings of the 25th Asia and South Pacific Design Automation Conference, 2020

2019
An Open Source FPGA-Optimized Out-of-Order RISC-V Soft Processor.
Proceedings of the International Conference on Field-Programmable Technology, 2019

WiXI: An Inter-Chip Wireless Bus Interface for Shape-Changeable Chiplet-Based Computers.
Proceedings of the 37th IEEE International Conference on Computer Design, 2019

A Sensing Technique for Data Glove Using Conductive Fiber.
Proceedings of the Extended Abstracts of the 2019 CHI Conference on Human Factors in Computing Systems, 2019

2018
Escalator Network for a 3D Chip Stack with Inductive Coupling ThruChip Interface.
Int. J. Netw. Comput., 2018

QUEST: A 7.49TOPS multi-purpose log-quantized DNN inference engine stacked on 96MB 3D SRAM using inductive-coupling technology in 40nm CMOS.
Proceedings of the 2018 IEEE International Solid-State Circuits Conference, 2018

An Area-Efficient Out-of-Order Soft-Core Processor Without Register Renaming.
Proceedings of the International Conference on Field-Programmable Technology, 2018

2017
An inductive-coupling link for 3-D Network-on-Chips.
Proceedings of the International SoC Design Conference, 2017

A Practical Collision Avoidance Method for an Inter-Chip Bus with Wireless Inductive through Chip Interface.
Proceedings of the Fifth International Symposium on Computing and Networking, 2017

2016
A 6 Gb/s 6 pJ/b 5 mm-Distance Non-Contact Interface for Modular Smartphones Using Two-Fold Transmission Line Coupler and High EMC Tolerant Pulse Transceiver.
IEEE J. Solid State Circuits, 2016

Analysis and Evaluation of Electromagnetic Interference between ThruChip Interface and LC-VCO.
IEICE Trans. Electron., 2016

Vertical Packet Switching Elevator Network Using Inductive Coupling ThruChip Interface.
Proceedings of the Fourth International Symposium on Computing and Networking, 2016

A 1 Tb/s/mm<sup>2</sup> inductive-coupling side-by-side chip link.
Proceedings of the ESSCIRC Conference 2016: 42<sup>nd</sup> European Solid-State Circuits Conference, 2016

An inductive-coupling bus with collision detection scheme using magnetic field variation for 3-D network-on-chips.
Proceedings of the IEEE Asian Solid-State Circuits Conference, 2016

Analytical thruchip inductive coupling channel design optimization.
Proceedings of the 21st Asia and South Pacific Design Automation Conference, 2016

2015
A Study of Physical Design Guidelines in ThruChip Inductive Coupling Channel.
IEICE Trans. Fundam. Electron. Commun. Comput. Sci., 2015

10.1 A 6Gb/s 6pJ/b 5mm-distance non-contact interface for modular smartphones using two-fold transmission-line coupler and EMC-qualified pulse transceiver.
Proceedings of the 2015 IEEE International Solid-State Circuits Conference, 2015

Design and analysis for ThruChip design for manufacturing (DFM).
Proceedings of the 20th Asia and South Pacific Design Automation Conference, 2015


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