Jungi Choi
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Bibliography
2013
Transceiver with inductive coupling for wireless chip-to-chip communication using a 50-nm digital CMOS process.
Microelectron. J., 2013
Test and debug strategy for TSMC CoWoS™ stacking process based heterogeneous 3D IC: A silicon case study.
Proceedings of the 2013 IEEE International Test Conference, 2013