Jung Hak Kim

According to our database, Jung Hak Kim authored at least 1 paper in 2019.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of six.

2019

Development of Laser-Assisted Bonding with Compression (LABC) Process for 3D IC Integration.

Kwang-Seong Choi, Yong-Sung Eom, Seok Hwan Moon, Jiho Joo, Kwangjoo Lee, Jung Hak Kim, Ju Hyeon Kim

Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019