Jun Liu

Orcid: 0009-0009-5326-2657

Affiliations:
  • Hefei University of Technology, School of Computer and Information, China


According to our database1, Jun Liu authored at least 6 papers between 2019 and 2024.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
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Links

Online presence:

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Bibliography

2024
Voltage Skew-Based Test Technique for Pre-Bond TSVs in 3-D ICs.
IEEE Trans. Circuits Syst. II Express Briefs, August, 2024

A Self-Biased Current Reference Source-Based Pre-Bond TSV Test Solution.
IEEE Trans. Very Large Scale Integr. Syst., April, 2024

A Symmetric Bridge-Based Pre-Bond TSV Faults Detection Method.
IEEE Trans. Instrum. Meas., 2024

A Scan-Chain-Based Built-in Self-Test for ILV in Monolithic 3-D ICs.
IEEE Trans. Instrum. Meas., 2024

2020
SleepGuardian: An RF-Based Healthcare System Guarding Your Sleep from Afar.
IEEE Netw., 2020

2019
Your WiFi Knows You Fall: A Channel Data-Driven Device-Free Fall Sensing System.
Proceedings of the 2019 IEEE International Conference on Communications, 2019


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