Jun Li

Affiliations:

Chinese Academy of Sciences, Institute of Microelectronics, System Packaging and Integration Research Center, Beijing, China

According to our database¹, Jun Li authored at least 9 papers between 2016 and 2023.

Collaborative distances:

Dijkstra number² of five.
Erdős number³ of four.

Timeline

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Bibliography

2023

Long-distance and anti-disturbance wireless power transfer based on concentric three-coil resonator and inhomogeneous electromagnetic metamaterials.

[BibT_eX]

[DOI]

Int. J. Circuit Theory Appl., May, 2023

2022

Antenna in package design and measurement for millimeter-wave applications in fan-out wafer-level package.

[BibT_eX]

[DOI]

IEICE Electron. Express, 2022

2021

Design of a Ka-band receiver front end using Si-based system in package.

[BibT_eX]

[DOI]

IEICE Electron. Express, 2021

Si-based Ka-band SIW band-pass filter using wafer level manufacturing process.

[BibT_eX]

[DOI]

IEICE Electron. Express, 2021

An optimization method for conformal shielding.

[BibT_eX]

[DOI]

IEICE Electron. Express, 2021

Si-based system-in-package design with broadband interconnection for E-band applications.

[BibT_eX]

[DOI]

IEICE Electron. Express, 2021

2018

Warpage simulation and experimental verification for 320 mm × 320 mm panel level fan-out packaging based on die-first process.

[BibT_eX]

[DOI]

Microelectron. Reliab., 2018

2017

Study on Magnetic Probe Calibration in Near-field Measurement System for EMI Application.

[BibT_eX]

[DOI]

J. Electron. Test., 2017

2016

Optimization and validation of thermal management for a RF front-end SiP based on rigid-flex substrate.

[BibT_eX]

[DOI]

Microelectron. Reliab., 2016

Jun Li

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Bibliography

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