Julien Ryckaert

According to our database1, Julien Ryckaert authored at least 71 papers between 2005 and 2024.

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Bibliography

2024
Multidie 3-D Stacking of Memory Dominated Neuromorphic Architectures.
IEEE Trans. Very Large Scale Integr. Syst., November, 2024

Backside Power Delivery in High Density and High Performance Context: IR-Drop and Block-Level Power-Performance-Area Benefits.
Proceedings of the IEEE Symposium on VLSI Technology and Circuits 2024, 2024

Thermal Considerations for Block-Level PPA Assessment in Angstrom Era: A Comparison Study of Nanosheet FETs (A10) & Complementary FETs (A5).
Proceedings of the IEEE Symposium on VLSI Technology and Circuits 2024, 2024

On-chip Memory in Accelerator-based Systems: A System Technology Co-Optimization (STCO) Perspective for Emerging Device Technologies.
Proceedings of the 37th IEEE International System-on-Chip Conference, 2024

Accelerating Large Language Model Training with In-Package Optical Links for Scale-Out Systems.
Proceedings of the IEEE Computer Society Annual Symposium on VLSI, 2024

Thermal Implications in Scaling High-Performance Server 3D Chiplet-Based 2.5D SoC from FinFET to Nanosheet.
Proceedings of the IEEE Computer Society Annual Symposium on VLSI, 2024

STCO: Driving the More than Moore Era.
Proceedings of the IEEE Computer Society Annual Symposium on VLSI, 2024

3D Partitioning with Pipeline Optimization for Low-Latency Memory Access in Many-Core SoCs.
Proceedings of the IEEE International Symposium on Circuits and Systems, 2024

Thermal Performance Evaluation of Multi-Core SOCs Using Power-Thermal Co-Simulation.
Proceedings of the IEEE International Reliability Physics Symposium, 2024

Thermal Analysis of High-Performance Server SoCs from FinFET to Nanosheet Technologies.
Proceedings of the IEEE International Reliability Physics Symposium, 2024

Smoothing Disruption Across the Stack: Tales of Memory, Heterogeneity, & Compilers.
Proceedings of the Design, Automation & Test in Europe Conference & Exhibition, 2024

GNN-assisted Back-side Clock Routing Methodology for Advance Technologies.
Proceedings of the 61st ACM/IEEE Design Automation Conference, 2024

2023
3D SRAM Macro Design in 3D Nanofabric Process Technology.
IEEE Trans. Circuits Syst. I Regul. Pap., July, 2023

PPA and Scaling Potential of Backside Power Options in N2 and A14 Nanosheet Technology.
Proceedings of the 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2023

Block-level Evaluation and Optimization of Backside PDN for High-Performance Computing at the A14 node.
Proceedings of the 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2023

Impact of interconnects enhancement on SRAM design beyond 5nm technology node.
Proceedings of the IEEE International Symposium on Circuits and Systems, 2023

Design Technology co-optimization of 1D-1VCMA to improve read performance for SCM applications.
Proceedings of the IEEE International Symposium on Circuits and Systems, 2023

Towards Chip-Package-System Co-optimization of Thermally-limited System-On-Chips (SOCs).
Proceedings of the IEEE International Reliability Physics Symposium, 2023

MNEMOSENE++: Scalable Multi-Tile Design with Enhanced Buffering and VGSOT-MRAM based Compute-in-Memory Crossbar Array.
Proceedings of the 30th IEEE International Conference on Electronics, Circuits and Systems, 2023

2022
Evaluation of Nanosheet and Forksheet Width Modulation for Digital IC Design in the Sub-3-nm Era.
IEEE Trans. Very Large Scale Integr. Syst., 2022

Self-Heating in iN8-iN2 CMOS Logic Cells: Thermal Impact of Architecture (FinFET, Nanosheet, Forksheet and CFET) and Scaling Boosters.
Proceedings of the IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), 2022


Enabling Active Backside Technology for ESD and LU Reliability in DTCO/STCO.
Proceedings of the IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), 2022

PPAC of sheet-based CFET configurations for 4 track design with 16nm metal pitch.
Proceedings of the IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), 2022

Backside PDN and 2.5D MIMCAP to Double Boost 2D and 3D ICs IR-Drop beyond 2nm Node.
Proceedings of the IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), 2022

Design enablement of CFET devices for sub-2nm CMOS nodes.
Proceedings of the 2022 Design, Automation & Test in Europe Conference & Exhibition, 2022

2021
Performance Trade-Off Scenarios for GAA Nanosheet FETs Considering Inner-spacers and Epi-induced Stress: Understanding & Mitigating Process Risks.
Proceedings of the 51st IEEE European Solid-State Device Research Conference, 2021

2020
Heterogeneous 3D Integration for a RISC-V System With STT-MRAM.
IEEE Comput. Archit. Lett., 2020

3D Nanofabric: Layout Challenges and Solutions for Ultra-scaled Logic Designs.
Proceedings of the VLSI-SoC: Design Trends, 2020

Layout Considerations of Logic Designs Using an N-layer 3D Nanofabric Process Flow.
Proceedings of the 28th IFIP/IEEE International Conference on Very Large Scale Integration, 2020

Device Scaling roadmap and its implications for Logic and Analog platform.
Proceedings of the IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium, 2020

2019
Process, Circuit and System Co-optimization of Wafer Level Co-Integrated FinFET with Vertical Nanosheet Selector for STT-MRAM Applications.
Proceedings of the 56th Annual Design Automation Conference 2019, 2019

2017
Statistical Timing Analysis Considering Device and Interconnect Variability for BEOL Requirements in the 5-nm Node and Beyond.
IEEE Trans. Very Large Scale Integr. Syst., 2017

SRAM designs for 5nm node and beyond: Opportunities and challenges.
Proceedings of the 2017 IEEE International Conference on IC Design and Technology, 2017

2016
Scaling Beyond 7nm: Design-Technology Co-optimization at the Rescue.
Proceedings of the 2016 on International Symposium on Physical Design, 2016

2015
Design technology co-optimization for enabling 5nm gate-all-around nanowire 6T SRAM.
Proceedings of the 2015 International Conference on IC Design & Technology, 2015

Impact of interconnect multiple-patterning variability on SRAMs.
Proceedings of the 2015 Design, Automation & Test in Europe Conference & Exhibition, 2015

Holisitic device exploration for 7nm node.
Proceedings of the 2015 IEEE Custom Integrated Circuits Conference, 2015

2014
Circuit and process co-design with vertical gate-all-around nanowire FET technology to extend CMOS scaling for 5nm and beyond technologies.
Proceedings of the 44th European Solid State Device Research Conference, 2014

ParaDIME: Parallel Distributed Infrastructure for Minimization of Energy.
Proceedings of the 17th Euromicro Conference on Digital System Design, 2014


2013
Low-power, low-penalty, flip-chip integrated, 10Gb/s ring-based 1V CMOS photonics transmitter.
Proceedings of the 2013 Optical Fiber Communication Conference and Exposition and the National Fiber Optic Engineers Conference (OFC/NFOEC), 2013

TEASE: a systematic analysis framework for early evaluation of FinFET-based advanced technology nodes.
Proceedings of the 50th Annual Design Automation Conference 2013, 2013

2012
RF-to-Baseband Digitization in 40 nm CMOS With RF Bandpass ΔΣ Modulator and Polyphase Decimation Filter.
IEEE J. Solid State Circuits, 2012

Low-Power, 10-Gbps 1.5-Vpp differential CMOS driver for a silicon electro-optic ring modulator.
Proceedings of the IEEE 2012 Custom Integrated Circuits Conference, 2012

A calibrated pathfinding model for signal integrity analysis on interposer.
Proceedings of the IEEE 2012 Custom Integrated Circuits Conference, 2012

2011
DRAM-on-logic Stack - Calibrated thermal and mechanical models integrated into PathFinding flow.
Proceedings of the 2011 IEEE Custom Integrated Circuits Conference, 2011

2010
A 0.5 mm <sup>2</sup> Power-Scalable 0.5-3.8-GHz CMOS DT-SDR Receiver With Second-Order RF Band-Pass Sampler.
IEEE J. Solid State Circuits, 2010

Multirate Cascaded Discrete-Time Low-Pass ΔΣ Modulator for GSM/Bluetooth/UMTS.
IEEE J. Solid State Circuits, 2010

A 100kHz-10MHz BW, 78-to-52dB DR, 4.6-to-11mW flexible SC ΣΔ modulator in 1.2-V 90-nm CMOS.
Proceedings of the 36th European Solid-State Circuits Conference, 2010

An 11.6-19.3mW 0.375-13.6GHz CMOS frequency synthesizer with rail-to-rail operation.
Proceedings of the Design, Automation and Test in Europe, 2010

2009
A 2.4 GHz Low-Power Sixth-Order RF Bandpass ΔΣ Converter in CMOS.
IEEE J. Solid State Circuits, 2009

A 2-mm<sup>2</sup> 0.1-5 GHz Software-Defined Radio Receiver in 45-nm Digital CMOS.
IEEE J. Solid State Circuits, 2009

A Low-Complexity, Low-Phase-Noise, Low-Voltage Phase-Aligned Ring Oscillator in 90 nm Digital CMOS.
IEEE J. Solid State Circuits, 2009

A 2mm<sup>2</sup> 0.1-to-5GHz SDR receiver in 45nm digital CMOS.
Proceedings of the IEEE International Solid-State Circuits Conference, 2009

A multirate 3.4-to-6.8mW 85-to-66dB DR GSM/bluetooth/UMTS cascade DT ΔΣM in 90nm digital CMOS.
Proceedings of the IEEE International Solid-State Circuits Conference, 2009

2008
A Low Power, Reconfigurable IR-UWB System.
Proceedings of IEEE International Conference on Communications, 2008

A low-complexity, low phase noise, low-voltage phase-aligned ring oscillator in 90 nm digital CMOS.
Proceedings of the ESSCIRC 2008, 2008

2007
A CMOS Ultra-Wideband Receiver for Low Data-Rate Communication.
IEEE J. Solid State Circuits, 2007

A 0.65-to-1.4 nJ/Burst 3-to-10 GHz UWB All-Digital TX in 90 nm CMOS for IEEE 802.15.4a.
IEEE J. Solid State Circuits, 2007

Optimized Signal Acquisition for Low-Complexity and Low-Power IR-UWB Transceivers.
Proceedings of the 65th IEEE Vehicular Technology Conference, 2007

A 0.65-to-1.4nJ/burst 3-to-10GHz UWB Digital TX in 90nm CMOS for IEEE 802.15.4a.
Proceedings of the 2007 IEEE International Solid-State Circuits Conference, 2007

A fast start-up 3GHz-10GHz digitally controlled oscillator for UWB impulse radio in 90nm CMOS.
Proceedings of the 33rd European Solid-State Circuits Conference, 2007

2006
Ultra-wideband channel model for communication around the human body.
IEEE J. Sel. Areas Commun., 2006

Analog-Digital Partitioning for Low-Power UWB Impulse Radios under CMOS Scaling.
EURASIP J. Wirel. Commun. Netw., 2006

Human++: Emerging Technology for Body Area Networks.
Proceedings of the VLSI-SoC: Research Trends in VLSI and Systems on Chip, 2006

Human++: Emerging Technology for Body Area Networks.
Proceedings of the IFIP VLSI-SoC 2006, 2006

A 16mA UWB 3-to-5GHz 20Mpulses/s Quadrature Analog Correlation Receiver in 0.18µm CMOS.
Proceedings of the 2006 IEEE International Solid State Circuits Conference, 2006

2005
Ultra-wide-band transmitter for low-power wireless body area networks: design and evaluation.
IEEE Trans. Circuits Syst. I Regul. Pap., 2005

Ultra wide-band body area channel model.
Proceedings of IEEE International Conference on Communications, 2005

Human++: autonomous wireless sensors for body area networks.
Proceedings of the IEEE 2005 Custom Integrated Circuits Conference, 2005


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