Jui-Han Liu

According to our database, Jui-Han Liu authored at least 2 papers between 2019 and 2022.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2022

Room Temperature Cu-Cu Direct Bonding Using Wetting/Passivation Scheme for 3D Integration and Packaging.

Zhong-Jie Hong, Demin Liu, Shu-Ting Hsieh, Han-Wen Hu, Ming-Wei Weng, Chih-I Cho, Jui-Han Liu, Kuan-Neng Chen

Proceedings of the IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), 2022

2019

Temperature Cycling Reliability of WOW Bumpless Through Silicon Vias.

Chia-Hsuan Lee, Hsin-Chi Chang, Jui-Han Liu, Hiroyuki Ito, Young-Suk Kim, Kuan-Neng Chen, Takayuki Ohba

Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019