Juan S. Ordonez

According to our database1, Juan S. Ordonez authored at least 18 papers between 2011 and 2018.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

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Links

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Bibliography

2018
PDMS Gasket Underfill for Long-Term Insulation of High-Density Interconnections in Active Implantable Medical Devices.
Proceedings of the 40th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, 2018

2017
Concept and Development of an Electronic Framework Intended for Electrode and Surrounding Environment Characterization In Vivo.
Sensors, 2017

Let There Be Light - Optoprobes for Neural Implants.
Proc. IEEE, 2017

Improved long-term stability of thin-film glassy carbon electrodes through the use of silicon carbide and amorphous carbon.
Proceedings of the 8th International IEEE/EMBS Conference on Neural Engineering, 2017

Mechanical deformation and chemical degradation of thin-film platinum under aging and electrical stimulation.
Proceedings of the 8th International IEEE/EMBS Conference on Neural Engineering, 2017

Dual-sided process with graded interfaces for adhering underfill and globtop materials to microelectrode arrays.
Proceedings of the 8th International IEEE/EMBS Conference on Neural Engineering, 2017

2015
Hybrid multimodal Deep Brain probe (DBS array) for advanced brain research.
Proceedings of the 7th International IEEE/EMBS Conference on Neural Engineering, 2015

Mechanical deformation of thin film platinum under electrical stimulation.
Proceedings of the 37th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, 2015

Development of a multichannel implantable connector.
Proceedings of the 37th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, 2015

Non-hermetic encapsulation for implantable electronic devices based on epoxy.
Proceedings of the 37th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, 2015

2014
Cuff electrodes for very small diameter nerves - Prototyping and first recordings in vivo.
Proceedings of the 36th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, 2014

A polymer-metal two step sealing concept for hermetic neural implant packages.
Proceedings of the 36th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, 2014

2012
Hermetic electronic packaging of an implantable brain-machine-interface with transcutaneous optical data communication.
Proceedings of the Annual International Conference of the IEEE Engineering in Medicine and Biology Society, 2012

A 232-channel retinal vision prosthesis with a miniaturized hermetic package.
Proceedings of the Annual International Conference of the IEEE Engineering in Medicine and Biology Society, 2012

Hermetic glass soldered micro-packages for a vision prosthesis.
Proceedings of the Annual International Conference of the IEEE Engineering in Medicine and Biology Society, 2012

Improved polyimide thin-film electrodes for neural implants.
Proceedings of the Annual International Conference of the IEEE Engineering in Medicine and Biology Society, 2012

2011
Ensuring minimal humidity levels in hermetic implant housings.
Proceedings of the 33rd Annual International Conference of the IEEE Engineering in Medicine and Biology Society, 2011

A blister-test apparatus for studies on the adhesion of materials used for neural electrodes.
Proceedings of the 33rd Annual International Conference of the IEEE Engineering in Medicine and Biology Society, 2011


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