Josef Weber

According to our database, Josef Weber authored at least 5 papers between 2010 and 2019.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2019

Fraunhofer's Initial and Ongoing Contributions in 3D IC Integration.

Peter Ramm, Armin Klumpp, Christof Landesberger, Josef Weber, Andy Heinig, Peter Schneider, Günter Elst, Manfred Engelhardt

Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

2016

3D TSV based high frequency components for RF IC and RF MEMS applications.

Montserrat Fernandez-Bolaños, Wolfgang A. Vitale, Mariazel Maqueda Lopez, Adrian M. Ionescu, Armin Klumpp, Karl-Reinhard Merkel, Josef Weber, Peter Ramm, Ilja Ocket, Walter De Raedt, Amin Enayati

Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

2015

Current and future 3D activities at Fraunhofer.

Andy Heinig, Muhammad Waqas Chaudhary, Peter Schneider, Peter Ramm, Josef Weber

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

2010

3D Integration technology: Status and application development.

Peter Ramm, Armin Klumpp, Josef Weber, Nicolas Lietaer, Maaike Taklo, Walter De Raedt, Thomas Fritzsch, Pascal Couderc

Proceedings of the 36th European Solid-State Circuits Conference, 2010

Application of the SLID-ICV interconnection technology for the ATLAS pixel upgrade at SLHC.

Ladislav Andricek, Michael Beimforde, Armin Klumpp, Anna Macchiolo, Karl-Reinhard Merkel, Hans-Günther Moser, Richard Nisius, Rainer Helmut Richter, Josef Weber, Philipp Weigell, Robert Wieland

Proceedings of the IEEE International Conference on 3D System Integration, 2010