Jörg Kludt

According to our database, Jörg Kludt authored at least 7 papers between 2012 and 2014.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of five.

2014

Degradation behavior in upstream/downstream via test structures.

Jörg Kludt, Kirsten Weide-Zaage, Markus Ackermann, Verena Hein, Christian Kovács

Microelectron. Reliab., 2014

Evaluation new corner stress relief structure layout for high robust metallization.

Verena Hein, Jörg Kludt, Kirsten Weide-Zaage

Microelectron. Reliab., 2014

Qualification procedure for moisture in embedded capacitors.

Hélène Frémont, Jörg Kludt, Massar Wade, Kirsten Weide-Zaage, Isabelle Bord-Majek, Geneviève Duchamp

Microelectron. Reliab., 2014

Simulation in 3D integration and TSV.

Kirsten Weide-Zaage, Aymen Moujbani, Jörg Kludt

Proceedings of the IEEE 5th Latin American Symposium on Circuits and Systems, 2014

2013

Dynamic simulation of migration induced failure mechanism in integrated circuit interconnects.

Aymen Moujbani, Jörg Kludt, Kirsten Weide-Zaage, Markus Ackermann, Verena Hein, Lutz Meinshausen

Microelectron. Reliab., 2013

Dynamic simulation of octahedron slotted metal structures.

Jörg Kludt, Kirsten Weide-Zaage, Markus Ackermann, Verena Hein

Microelectron. Reliab., 2013

2012

Simulation of the influence of TiAl₃ layers on the thermal-electrical and mechanical behaviour of Al metallizations.

Jörg Kludt, Kirsten Weide-Zaage, Markus Ackermann, Verena Hein

Microelectron. Reliab., 2012