Jörg Bauer

According to our database, Jörg Bauer authored at least 6 papers between 2008 and 2015.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2015

From fan-out wafer to fan-out panel level packaging.

Tanja Braun, K.-F. Becker, S. Raatz, V. Bader, Jörg Bauer, Rolf Aschenbrenner, S. Voges, Tina Thomas, R. Kahle, Klaus-Dieter Lang

Proceedings of the European Conference on Circuit Theory and Design, 2015

2013

Transport of moisture at epoxy-SiO₂ interfaces investigated by molecular modeling.

O. Hölck, Jörg Bauer, Tanja Braun, Hans Walter, Olaf Wittler, Bernhard Wunderle, Klaus-Dieter Lang

Microelectron. Reliab., 2013

2012

Comparative characterization of chip to epoxy interfaces by molecular modeling and contact angle determination.

O. Hölck, Jörg Bauer, Olaf Wittler, Bernd Michel, Bernhard Wunderle

Microelectron. Reliab., 2012

2011

Basic thermo-mechanical property estimation of a 3D-crosslinked epoxy/SiO₂ interface using molecular modelling.

O. Hölck, E. Dermitzaki, Bernhard Wunderle, Jörg Bauer, Bernd Michel

Microelectron. Reliab., 2011

2010

Molecular dynamics approach to structure-property correlation in epoxy resins for thermo-mechanical lifetime modeling.

Bernhard Wunderle, E. Dermitzaki, O. Hölck, Jörg Bauer, Hans Walter, Q. Shaik, K. Rätzke, Franz Faupel, Bernd Michel, Herbert Reichl

Microelectron. Reliab., 2010

2008

Lamination And Microstructuring Technology for a Bio-Cell Multiwell array

Erik Jung, Dionysios Manessis, Alexander Neumann, Lars Böttcher, Tanja Braun, Jörg Bauer, Herbert Reichl, Bruno Iafelice, Federica Destro, Roberto Gambari

CoRR, 2008