Joong Do Kim

According to our database, Joong Do Kim authored at least 1 paper in 2012.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2012

Flexible Chip-on-Flex (COF) and embedded Chip-in-Flex (CIF) packages by applying wafer level package (WLP) technology using anisotropic conductive films (ACFs).

Kyoung-Lim Suk, Ho-Young Son, Chang-Kyu Chung, Joong Do Kim, Jin-Woo Lee, Kyung-Wook Paik

Microelectron. Reliab., 2012