Jongmin Kim
Affiliations:- Chung-Ang University, School of Mechanical Engineering, Seoul, South Korea
According to our database1,
Jongmin Kim
authored at least 5 papers
between 2010 and 2012.
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Bibliography
2012
Characteristics of solderable electrically conductive adhesives (ECAs) for electronic packaging.
Microelectron. Reliab., 2012
The effects of functionalized graphene nanosheets on the thermal and mechanical properties of epoxy composites for anisotropic conductive adhesives (ACAs).
Microelectron. Reliab., 2012
2011
Mechanical and wetting properties of epoxy resins: Amine-containing epoxy-terminated siloxane oligomer with or without reductant.
Microelectron. Reliab., 2011
Dispersion, hybrid interconnection and heat dissipation properties of functionalized carbon nanotubes in epoxy composites for electrically conductive adhesives (ECAs).
Microelectron. Reliab., 2011
2010
Effects of novel carboxylic acid-based reductants on the wetting characteristics of anisotropic conductive adhesive with low melting point alloy filler.
Microelectron. Reliab., 2010