Jonghyun Cho

According to our database, Jonghyun Cho authored at least 13 papers between 2011 and 2017.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2017

TEM-Like Launch Geometries and Simplified De-embedding for Accurate Through Silicon Via Characterization.

Francesco de Paulis, Stefano Piersanti, Qian Wang, Jonghyun Cho, Nicholas Erickson, Brice Achkir, Jun Fan, James L. Drewniak, Antonio Orlandi

IEEE Trans. Instrum. Meas., 2017

Electromagnetic Interference Analysis of an Inhomogeneous Electromagnetic Bandgap Power Bus for High-Speed Circuits.

Jonghyun Cho, Myunghoi Kim

J. Inform. and Commun. Convergence Engineering, 2017

2016

Suppression of Parallel Plate Modes Using Edge-Located EBG Structure in High-Speed Power Bus.

Jonghyun Cho, Myunghoi Kim

J. Inform. and Commun. Convergence Engineering, 2016

High-Frequency Temperature-Dependent Through-Silicon-Via (TSV) Model and High-Speed Channel Performance for 3-D ICs.

Manho Lee, Daniel H. Jung, Heegon Kim, Jonghyun Cho, Joungho Kim

IEEE Des. Test, 2016

2015

Noise coupling modeling and analysis of through glass via(TGV).

Insu Hwang, Jihye Kim, Youngwoo Kim, Jonghyun Cho, Joungho Kim

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

2014

Analysis and optimization of a power distribution network in 2.5D IC with glass interposer.

Youngwoo Kim, Jonghyun Cho, Kiyeong Kim, Heegon Kim, Joungho Kim, Srikrishna Sitaraman, Venky Sundaram, Rao R. Tummala

Proceedings of the 2014 International 3D Systems Integration Conference, 2014

2013

Signal integrity design of TSV and interposer in 3D-IC.

Jonghyun Cho, Joungho Kim

Proceedings of the 4th IEEE Latin American Symposium on Circuits and Systems, 2013

Design and measurement of a compact on-interposer passive equalizer for chip-to-chip high-speed differential signaling.

Heegon Kim, Jonghyun Cho, Daniel H. Jung, Jonghoon J. Kim, Sumin Choi, Joungho Kim, Junho Lee, Kunwoo Park

Proceedings of the 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits, 2013

Eye-diagram simulation and analysis of a high-speed TSV-based channel.

Heegon Kim, Jonghyun Cho, Jonghoon J. Kim, Daniel H. Jung, Sumin Choi, Joungho Kim, Junho Lee, Kunwoo Park

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

Fault isolation of short defect in through silicon via (TSV) based 3D-IC.

Daniel H. Jung, Jonghyun Cho, Heegon Kim, Jonghoon J. Kim, Hongseok Kim, Joungho Kim, Hyun-Cheol Bae, Kwang-Seong Choi

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

Analysis of glass interposer PDN and proposal of PDN resonance suppression methods.

Jonghyun Cho, Youngwoo Kim, Joungho Kim, Venky Sundaram, Rao R. Tummala

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

2011

Analysis of TSV-to-TSV coupling with high-impedance termination in 3D ICs.

Taigon Song, Chang Liu, Dae Hyun Kim, Sung Kyu Lim, Jonghyun Cho, Joohee Kim, Junso Pak, Seungyoung Ahn, Joungho Kim, Kihyun Yoon

Proceedings of the 12th International Symposium on Quality Electronic Design, 2011

Full-chip TSV-to-TSV coupling analysis and optimization in 3D IC.

Chang Liu, Taigon Song, Jonghyun Cho, Joohee Kim, Joungho Kim, Sung Kyu Lim

Proceedings of the 48th Design Automation Conference, 2011