Jong-Kai Lin

According to our database¹, Jong-Kai Lin authored at least 2 papers between 2015 and 2016.

Collaborative distances:

Dijkstra number² of five.
Erdős number³ of five.

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PhD thesis

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Bibliography

2016

Reliability study of 3D IC packaging based on through-silicon interposer (TSI) and silicon-less interconnection technology (SLIT) using finite element analysis.

[BibT_eX]

[DOI]

Fa Xing Che

Xiaowu Zhang

Jong-Kai Lin

Microelectron. Reliab., 2016

2015

Fabrication and Assembly of Cu-RDL-Based 2.5-D Low-Cost Through Silicon Interposer (LC-TSI).

[BibT_eX]

[DOI]

Srinivasa Rao Vempati

Surya Bhattacharya

IEEE Des. Test, 2015

Jong-Kai Lin

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