Jong Chul Park

According to our database, Jong Chul Park authored at least 5 papers between 2007 and 2024.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2024

13.3 A 280-Layer 1Tb 4b/cell 3D-NAND Flash Memory with a 28.5Gb/mm2 Areal Density and a 3.2GB/s High-Speed IO Rate.

Wontaeck Jung, Hyunggon Kim, Do-Bin Kim, Tae-Hyun Kim, Nam-Hee Lee, Dongjin Shin, Minyoung Kim, Youngsik Rho, Hun-Jong Lee, Yujin Hyun, Jaeyoung Park, Taekyung Kim, Hwiwon Kim, Gyeongwon Lee, Jisang Lee, Joonsuc Jang, Jungmin Park, Sion Kim, Su Chang Jeon, Suyong Kim, Jung-Ho Song, Min-Seok Kim, Taesung Lee, Byung-Kwan Chun, Tongsung Kim, Young Gyu Lee, Hokil Lee, Soowoong Lee, Hwaseok Lee, Dooho Cho, Sangwan Nam, Yeomyung Kim, Kunyong Yoon, Yoonjae Lee, Sunghoon Kim, Jungseok Hwang, Raehyun Song, Hyunsik Jang, Jae-Ick Son, Hongsoo Jeon, Myunghun Lee, Mookyung Lee, Kisung Kim, Eungsuk Lee, Myeong-Woo Lee, Sungkyu Jo, Chan Ho Kim, Jong Chul Park, Kyunghwa Yun, Soonock Seol, Ji-Ho Cho, Seungjae Lee, Jin-Yub Lee, Sunghoi Hur

Proceedings of the IEEE International Solid-State Circuits Conference, 2024

2016

Drop-shock reliability improvement of embedded chip resistor packages through via structure modification.

Se-Hoon Park, Jong Chul Park, Jae-Yong Park, Young-Ho Kim

Microelectron. Reliab., 2016

2012

A system-on-package module by embedding a mobile TV IC in printed-circuit-board.

Jong In Ryu, Se-Hoon Park, Dongsu Kim, Jun Chul Kim, Hyeongdong Kim, Jong Chul Park

Proceedings of the 2012 IEEE Radio and Wireless Symposium, 2012

2010

A Highly Integrated Triple-Band RF Front-End Module for WiMAX Applications.

Dongsu Kim, Dong Ho Kim, Jong In Ryu, Chong-Dae Park, Jun Chul Kim, Jong Chul Park

IEICE Trans. Electron., 2010

2007

A korean search pattern in the like operation.

Sung Chul Park, Eun Hyang Lo, Jong Chul Park, Young Chul Park

Proceedings of the ICEIS 2007, 2007