Joke De Messemaeker

According to our database, Joke De Messemaeker authored at least 6 papers between 2012 and 2017.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2017

Impact of via density and passivation thickness on the mechanical integrity of advanced Back-End-Of-Line interconnects.

Luka Kljucar, Mario Gonzalez, Kristof Croes, Ingrid De Wolf, Joke De Messemaeker, Gayle Murdoch, Philip Nolmans, Joeri De Vos, Jürgen Bömmels, Eric Beyne, Zsolt Tökei

Microelectron. Reliab., 2017

2016

Reliability Challenges Related to TSV Integration and 3-D Stacking.

Kristof Croes, Joke De Messemaeker, Yunlong Li, Wei Guo, Olalla Varela Pedreira, Vladimir Cherman, Michele Stucchi, Ingrid De Wolf, Eric Beyne

IEEE Des. Test, 2016

2015

Microstructure simulation of grain growth in Cu through silicon vias using phase-field modeling.

Nabi Nabiollahi, Nele Moelans, Mario Gonzalez, Joke De Messemaeker, Christopher J. Wilson, Kristof Croes, Eric Beyne, Ingrid De Wolf

Microelectron. Reliab., 2015

Impact of oxide liner properties on TSV Cu pumping and TSV stress.

Joke De Messemaeker, O. Varela Pedreira, A. Moussa, Nabi Nabiollahi, Kris Vanstreels, Stefaan Van Huylenbroeck, Harold Philipsen, Patrick Verdonck, Bart Vandevelde, Ingrid De Wolf, Eric Beyne, Kris Croes

Proceedings of the IEEE International Reliability Physics Symposium, 2015

2014

Sn whisker evaluations in 3D microbumped structures.

George Vakanas, Björn Vandecasteele, David Schaubroeck, Joke De Messemaeker, Geert Willems, Mark Ashworth, Geoffrey D. Wilcox, Ingrid De Wolf

Microelectron. Reliab., 2014

2012

Diffusion growth of Cu₃Sn phase in the bump and thin film Cu/Sn structures.

Biljana Dimcic, Riet Labie, Joke De Messemaeker, Kris Vanstreels, Kris Croes, Bert Verlinden, Ingrid De Wolf

Microelectron. Reliab., 2012