John Slabbekoorn

According to our database, John Slabbekoorn authored at least 3 papers between 2016 and 2024.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2024

Clean Dicing: An Alternative Blade Dicing Technique for Minimising Particles in 3D Heterogeneous Integration.

Akito Hiro, Damien Jon Leech, Geert Schoofs, John Slabbekoorn, Alain Phommahaxay, Koen Kennes, Gerald Beyer, Eric Beyne

Proceedings of the International 3D Systems Integration Conference, 2024

2022

(Why do we need) Wireless Heterogeneous Integration (anyway?).

Michaël Peeters, S. Sinha, Xiao Sun, Claude Desset, Giuseppe Gramegna, John Slabbekoorn, Pieter Bex, Nelson Pinho, Tomas Webers, Dimitrios Velenis, Andy Miller, Nadine Collaert, Geert Van der Plas, Eric Beyne, M. Huynen, R. Broucke

Proceedings of the IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), 2022

2016

Die to wafer 3D stacking for below 10um pitch microbumps.

Jaber Derakhshandeh, Lin Hou, Inge De Preter, Carine Gerets, Samuel Suhard, Vikas Dubey, Geraldine Jamieson, Fumihiro Inoue, Tomas Webers, Pieter Bex, Giovanni Capuz, Eric Beyne, John Slabbekoorn, Teng Wang, Anne Jourdain, Gerald Beyer, Kenneth June Rebibis, Andy Miller

Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016