Johan Liu
According to our database1,
Johan Liu
authored at least 6 papers
between 2003 and 2017.
Collaborative distances:
Collaborative distances:
Awards
IEEE Fellow
IEEE Fellow 2006, "For contributions to environmentally compatible electronic materials and processes.".
Timeline
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Book In proceedings Article PhD thesis Dataset OtherLinks
On csauthors.net:
Bibliography
2017
Interface and interconnection stresses in electronic assemblies - A critical review of analytical solutions.
Microelectron. Reliab., 2017
2016
Mechanical and thermal characterization of a novel nanocomposite thermal interface material for electronic packaging.
Microelectron. Reliab., 2016
2007
Effect of different temperature cycling profiles on the crack initiation and propagation of Sn-3.5Ag wave soldered solder joints.
Microelectron. Reliab., 2007
2004
Microelectron. Reliab., 2004
2003
Microelectron. Reliab., 2003
Foldable Flex and Thinned Silicon Chips for Multichip Packaging; John Balde (Ed.), Kluwer Academic Publishers, Boston, USA, December 2002. Hardbound, 340 pp, Number of figures and tables 200, ISBN 0-7923-7676-5.
Microelectron. Reliab., 2003