Joachim N. Burghartz

Orcid: 0000-0002-6013-6677

Affiliations:

University of Stuttgart, Germany

According to our database¹, Joachim N. Burghartz authored at least 38 papers between 1996 and 2024.

Collaborative distances:

Dijkstra number² of four.
Erdős number³ of four.

Awards

IEEE Fellow

IEEE Fellow 2002, "For contributions to integrated high-speed and radio-frequency silicon devices and components.".

Timeline

Legend:

Book

In proceedings

Article

PhD thesis

Dataset

Other

Bibliography

2024

A 97-Channel Read-Out ASIC for an Electrophysiological Mapping Catheter With an Optical Link.

[BibT_eX]

[DOI]

IEEE Trans. Biomed. Circuits Syst., February, 2024

2022

Integrating Ultra-thin SiGe BiCMOS Power Amplifier Chip in Combination with Flexible Antenna in the Polymer Foil.

[BibT_eX]

[DOI]

Proceedings of the IEEE International Symposium on Circuits and Systems, 2022

Novel Normally-Off AlGaN/GaN-on-Si MIS-HEMT Exploiting Nanoholes Gate Structure.

[BibT_eX]

[DOI]

Proceedings of the 52nd IEEE European Solid-State Device Research Conference, 2022

An Integrated Optical Transceiver Circuit for Power Delivery and Bi-directional Data Communication in a Medical Catheter Device.

[BibT_eX]

[DOI]

Proceedings of the 48th IEEE European Solid State Circuits Conference, 2022

2021

Front-End Electronics for Beta-Cell Function Monitoring with an Integrated FOPP Detector.

[BibT_eX]

[DOI]

Proceedings of the 2021 IEEE Sensors, Sydney, Australia, October 31 - Nov. 3, 2021, 2021

A 96-Channel Electrophysiology Catheter with Integrated Read-Out ASIC and Optical Link.

[BibT_eX]

[DOI]

Proceedings of the 43rd Annual International Conference of the IEEE Engineering in Medicine & Biology Society, 2021

2020

Low-Power Organic Light Sensor Array Based on Active-Matrix Common-Gate Transimpedance Amplifier on Foil for Imaging Applications.

[BibT_eX]

[DOI]

IEEE J. Solid State Circuits, 2020

2019

A 2x2 Pixel Array Camera based on a Backside Illuminated Ge-on-Si Photodetector.

[BibT_eX]

[DOI]

Proceedings of the 2019 IEEE SENSORS, Montreal, QC, Canada, October 27-30, 2019, 2019

2018

3-Path SiGe BiCMOS power amplifier on thinned substrate for IoT applications.

[BibT_eX]

[DOI]

Integr., 2018

Localization and analysis of surface charges trapped in AlGaN/GaN HEMTs using multiple secondary MIS gates.

[BibT_eX]

[DOI]

Proceedings of the 48th European Solid-State Device Research Conference, 2018

2017

A new CMOS stress sensor ratiometric readout for in-plane stress magnitude and angle detection.

[BibT_eX]

[DOI]

Proceedings of the 2017 IEEE SENSORS, Glasgow, United Kingdom, October 29, 2017

Ultra-thin relative humidity sensors for hybrid system-in-foil applications.

[BibT_eX]

[DOI]

Proceedings of the 2017 IEEE SENSORS, Glasgow, United Kingdom, October 29, 2017

Comprehensive compact electro-thermal GaN HEMT model.

[BibT_eX]

[DOI]

Proceedings of the 47th European Solid-State Device Research Conference, 2017

2016

An Ultra-Thin Flexible CMOS Stress Sensor Demonstrated on an Adaptive Robotic Gripper.

[BibT_eX]

[DOI]

IEEE J. Solid State Circuits, 2016

600 V, low-leakage AlGaN/GaN MIS-HEMT on bulk GaN substrates.

[BibT_eX]

[DOI]

Proceedings of the 46th European Solid-State Device Research Conference, 2016

2015

Cost-Efficient Integration of Industrial Applications Using Smart Power Gate Arrays.

[BibT_eX]

[DOI]

Yipin Zhang

Cor Scherjon

Joachim N. Burghartz

IEEE Trans. Ind. Electron., 2015

16.1 An ultra-thin flexible CMOS stress sensor demonstrated on an adaptive robotic gripper.

[BibT_eX]

[DOI]

Proceedings of the 2015 IEEE International Solid-State Circuits Conference, 2015

2014

Hybrid Systems in foil (HySiF) exploiting ultra-thin flexible chips.

[BibT_eX]

[DOI]

Proceedings of the 44th European Solid State Device Research Conference, 2014

Thermal characterization and modeling of ultra-thin silicon chips.

[BibT_eX]

[DOI]

Proceedings of the 44th European Solid State Device Research Conference, 2014

Low-voltage organic transistors for flexible electronics.

[BibT_eX]

[DOI]

Proceedings of the Design, Automation & Test in Europe Conference & Exhibition, 2014

2012

A 3.3 V 6-Bit 100 kS/s Current-Steering Digital-to-Analog Converter Using Organic P-Type Thin-Film Transistors on Glass.

[BibT_eX]

[DOI]

IEEE J. Solid State Circuits, 2012

Manufacturing aspects of an ultra-thin chip technology.

[BibT_eX]

[DOI]

Evangelos A. Angelopoulos

Muhammad S. Al-Shahed

Proceedings of the 2012 European Solid-State Device Research Conference, 2012

2011

A 3.3V 6b 100kS/s current-steering D/A converter using organic thin-film transistors on glass.

[BibT_eX]

[DOI]

Proceedings of the IEEE International Solid-State Circuits Conference, 2011

2009

High Dynamic Range CMOS Imager Technologies for Biomedical Applications.

[BibT_eX]

[DOI]

IEEE J. Solid State Circuits, 2009

A 0.25µm logarithmic CMOS imager for emissivity-compensated thermography.

[BibT_eX]

[DOI]

Proceedings of the IEEE International Solid-State Circuits Conference, 2009

Ultra-thin chips and related applications, a new paradigm in silicon technology.

[BibT_eX]

[DOI]

Proceedings of the 35th European Solid-State Circuits Conference, 2009

2008

Ultra-Thin Chips on Foil for Flexible Electronics.

[BibT_eX]

[DOI]

Proceedings of the 2008 IEEE International Solid-State Circuits Conference, 2008

CMOS Imager Technologies for Biomedical Applications.

[BibT_eX]

[DOI]

Proceedings of the 2008 IEEE International Solid-State Circuits Conference, 2008

2005

Review of add-on process modules for high-frequency silicon technology.

[BibT_eX]

[DOI]

Joachim N. Burghartz

Microelectron. Reliab., 2005

2004

On the design of unilateral dual-loop feedback low-noise amplifiers with simultaneous noise, impedance, and IIP3 match.

[BibT_eX]

[DOI]

Mark P. van der Heijden

Leo C. N. de Vreede

Joachim N. Burghartz

IEEE J. Solid State Circuits, 2004

2003

Power amplifier PAE and ruggedness optimization by second-harmonic control.

[BibT_eX]

[DOI]

IEEE J. Solid State Circuits, 2003

2002

Mechanical Reliability of Silicon Wafers with Through-Wafer Vias for Wafer-Level Packaging.

[BibT_eX]

[DOI]

Alexander Polyakov

Marian Bartek

Joachim N. Burghartz

Microelectron. Reliab., 2002

2001

Status and trends of silicon RF technology.

[BibT_eX]

[DOI]

Joachim N. Burghartz

Microelectron. Reliab., 2001

1998

RF circuit design aspects of spiral inductors on silicon.

[BibT_eX]

[DOI]

IEEE J. Solid State Circuits, 1998

1997

An 11 GHz 3-V SiGe voltage controlled oscillator with integrated resonator.

[BibT_eX]

[DOI]

IEEE J. Solid State Circuits, 1997

Integrated RF components in a SiGe bipolar technology.

[BibT_eX]

[DOI]

IEEE J. Solid State Circuits, 1997

1996

A 3-V 4-GHz nMOS voltage-controlled oscillator with integrated resonator.

[BibT_eX]

[DOI]

IEEE J. Solid State Circuits, 1996

A 2.4-GHz silicon bipolar oscillator with integrated resonator.

[BibT_eX]

[DOI]

IEEE J. Solid State Circuits, 1996

Joachim N. Burghartz

Awards

IEEE Fellow

Timeline

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Online presence:

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Bibliography

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