Jixuan Wu

Orcid: 0000-0003-1171-7122

According to our database1, Jixuan Wu authored at least 19 papers between 2019 and 2024.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

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Bibliography

2024
Operation Scheme Optimizations to Achieve Ultra-high Endurance (1010) in Flash Memory with Robust Reliabilities.
CoRR, 2024

Unveiling Cryogenic Performance (4 to 300 K) Towards Ultra-Thin Ferroelectric HZO: Novel Kinetic Barrier Engineering and Underlying Mechanism.
Proceedings of the IEEE Symposium on VLSI Technology and Circuits 2024, 2024

First Demonstration of BEOL-Compatible 3D Vertical FeNOR.
Proceedings of the IEEE Symposium on VLSI Technology and Circuits 2024, 2024

2023
Energy-harvesting Q-learning secure routing algorithm with authenticated-encryption for WSN.
ICT Express, December, 2023

Near-threshold-voltage operation in flash-based high-precision computing-in-memory to implement Poisson image editing.
Sci. China Inf. Sci., December, 2023

High-Precision Short-Term Lifetime Prediction in TLC 3-D NAND Flash Memory as Hot-Data Storage.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., October, 2023

Maritime Ship Detection Method for Satellite Images Based on Multiscale Feature Fusion.
IEEE J. Sel. Top. Appl. Earth Obs. Remote. Sens., 2023

Dual-pulse disturb-free programming scheme for FeFET based neuromorphic computing.
Microelectron. J., 2023

Grain Size Reduction of Ferroelectric HZO Enabled by a Novel Solid Phase Epitaxy (SPE) Approach: Working Principle, Experimental Demonstration, and Theoretical Understanding.
Proceedings of the 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2023

Error Bits Recovering in 3D NAND Flash Memory: A Novel State-Shift Re-Program (SRP) Scheme.
Proceedings of the IEEE International Conference on Integrated Circuits, 2023

Opto-Electronic Monolayer ZnO Memristor Produced via Low Temperature Atomic Layer Deposition.
Proceedings of the IEEE International Conference on Integrated Circuits, 2023

Simulation for the Feasibility of IGZO Channel in 3D Vertical FeFET Memory Based on TCAD.
Proceedings of the IEEE International Conference on Integrated Circuits, 2023

Analyzing Weibo Data with Word2Vec and BiLSTM to Encourage Personal Income Tax Compliance in China.
Proceedings of the 15th International Conference on Machine Learning and Computing, 2023

One-shot Read Processing to Enhance Cold Data Retention in Charge-trap TLC 3D NAND Flash.
Proceedings of the 15th IEEE International Conference on ASIC, 2023

Flash-based Computing-in-memory Architectures with High-accuracy and Robust Reliabilities for General-purpose Applications.
Proceedings of the 15th IEEE International Conference on ASIC, 2023

2022
Safety intelligent relay node selection algorithm based on EH-WSN.
Proceedings of the 4th International Conference on Robotics, 2022

Large Suppression to Lateral Charge Migration (LCM) Related Error Bits in Charge-Trap TLC 3D NAND Flash.
Proceedings of the 2022 IEEE International Conference on Integrated Circuits, 2022

Work-in-Progress: High-Precision Short-Term Lifetime Prediction in TLC 3D NAND Flash Memory as Hot-data Storage.
Proceedings of the International Conference on Compilers, 2022

2019
Program/Erase Cycling Enhanced Lateral Charge Diffusion in Triple-Level Cell Charge-Trapping 3D NAND Flash Memory.
Proceedings of the IEEE International Reliability Physics Symposium, 2019


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