Jiwoo Pak

According to our database1, Jiwoo Pak authored at least 9 papers between 2011 and 2021.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

Legend:

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Article 
PhD thesis 
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Links

On csauthors.net:

Bibliography

2021
A graph placement methodology for fast chip design.
Nat., 2021

2020
Chip Placement with Deep Reinforcement Learning.
CoRR, 2020

2015
Electromigration-aware redundant via insertion.
Proceedings of the 20th Asia and South Pacific Design Automation Conference, 2015

2014
Electromigration Study for Multiscale Power/Ground Vias in TSV-Based 3-D ICs.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2014

2013
Electromigration study for multi-scale power/ground vias in TSV-based 3D ICs.
Proceedings of the IEEE/ACM International Conference on Computer-Aided Design, 2013

2012
Electromigration-aware routing for 3D ICs with stress-aware EM modeling.
Proceedings of the 2012 IEEE/ACM International Conference on Computer-Aided Design, 2012

Design for manufacturability and reliability for TSV-based 3D ICs.
Proceedings of the 17th Asia and South Pacific Design Automation Conference, 2012

2011
Electromigration modeling and full-chip reliability analysis for BEOL interconnect in TSV-based 3D ICs.
Proceedings of the 2011 IEEE/ACM International Conference on Computer-Aided Design, 2011

Robust Clock Tree Synthesis with timing yield optimization for 3D-ICs.
Proceedings of the 16th Asia South Pacific Design Automation Conference, 2011


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