Jiunn Chen
Orcid: 0000-0001-5601-5293
According to our database1,
Jiunn Chen
authored at least 3 papers
between 2009 and 2011.
Collaborative distances:
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Bibliography
2011
Investigation of growth behavior of Al-Cu intermetallic compounds in Cu wire bonding.
Microelectron. Reliab., 2011
2010
Redistribution in wafer level chip size packaging technology for high power device applications: Process and design considerations.
Microelectron. Reliab., 2010
2009
Towards elastic anisotropy and strain-induced void formation in Cu-Sn crystalline phases.
Microelectron. Reliab., 2009