Jing Xie

According to our database, Jing Xie authored at least 9 papers between 2010 and 2014.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2014

Testable cross-power domain interface (CPDI) circuit design in monolithic 3D technology.

Jing Xie, Yang Du, Yuan Xie

ACM J. Emerg. Technol. Comput. Syst., 2014

2013

Cost-driven 3D design optimization with metal layer reduction technique.

Qiaosha Zou, Jing Xie, Yuan Xie

Proceedings of the International Symposium on Quality Electronic Design, 2013

CPDI: Cross-power-domain interface circuit design in monolithic 3D technology.

Jing Xie, Yang Du, Yuan Xie

Proceedings of the International Symposium on Quality Electronic Design, 2013

2012

Mitigating electromigration of power supply networks using bidirectional current stress.

Jing Xie, Vijaykrishnan Narayanan, Yuan Xie

Proceedings of the Great Lakes Symposium on VLSI 2012, 2012

Yield-aware time-efficient testing and self-fixing design for TSV-based 3D ICs.

Jing Xie, Yu Wang, Yuan Xie

Proceedings of the 17th Asia and South Pacific Design Automation Conference, 2012

2010

Evaluation of using inductive/capacitive-coupling vertical interconnects in 3D network-on-chip.

Jin Ouyang, Jing Xie, Matthew Poremba, Yuan Xie

Proceedings of the 2010 International Conference on Computer-Aided Design, 2010

Architectural benefits and design challenges for three-dimensional integrated circuits.

Jing Xie, Jishen Zhao, Xiangyu Dong, Yuan Xie

Proceedings of the IEEE Asia Pacific Conference on Circuits and Systems, 2010

A 3D SoC design for H.264 application with on-chip DRAM stacking.

Tao Zhang, Kui Wang, Yi Feng, Yan Chen, Qun Li, Bing Shao, Jing Xie, Xiaodi Song, Lian Duan, Yuan Xie, Xu Cheng, Youn-Long Lin

Proceedings of the IEEE International Conference on 3D System Integration, 2010

3D memory stacking for fast checkpointing/restore applications.

Jing Xie, Xiangyu Dong, Yuan Xie

Proceedings of the IEEE International Conference on 3D System Integration, 2010