Jiexin Lin

According to our database, Jiexin Lin authored at least 3 papers between 2021 and 2024.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2024

Novel accurate steady-state thermal resistance model for power chips embedded in TTSVs heat dissipation array.

Linhong Lu, Xinghua Fu, Rui Hu, Fashun Yang, Jiexin Lin, Zhongchen Bai, Kui Ma

Microelectron. J., 2024

Embedded heat dissipation structure composed of TSVs gradually shrinking from bottom to top in stacked power chips.

Rui Hu, Mengru Huang, Linhong Lu, Fashun Yang, Jiexin Lin, Kui Ma, Zhao Ding

IEICE Electron. Express, 2024

2021

Advanced motor driving circuit with improved transfer efficiency based on adaptive segmented control.

Kui Ma, Kaiying Xu, Fashun Yang, Jiexin Lin

IEICE Electron. Express, 2021