Jiawei Liao

Orcid: 0009-0000-6256-642X

According to our database1, Jiawei Liao authored at least 20 papers between 2019 and 2024.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

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Bibliography

2024
A Sub-mm<sup>3</sup> Wireless Neural Stimulator IC for Visual Cortical Prosthesis With Optical Power Harvesting and 7.5-kb/s Data Telemetry.
IEEE J. Solid State Circuits, April, 2024

A 0.29pJ/Step Fully Discrete-Time Charge Domain Bridge-to-Digital Converter for Force Sensing in Spinal Implants Using RC Bridge.
Proceedings of the IEEE Symposium on VLSI Technology and Circuits 2024, 2024

Research on Point Cloud Registration Based on Key Points and Matching Point Pairs Algorithm.
Proceedings of the IGARSS 2024, 2024

2023
Quantitative Assessment Framework for Non-Structural Bird's Nest Risk Information of Transmission Tower in High-Resolution UAV Images.
IEEE Trans. Instrum. Meas., 2023

A Wireless Neural Stimulator IC for Cortical Visual Prosthesis.
Proceedings of the 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2023

A 1, 024-Channel, 64-Interconnect, Capacitive Neural Interface Using a Cross-Coupled Microelectrode Array and 2-Dimensional Code-Division Multiplexing.
Proceedings of the 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2023

An Enhanced PSO Algorithm for Aircraft Stand Reassignment Problem with Multiple Stand Sizes.
Proceedings of the 2023 8th International Conference on Intelligent Information Processing, 2023

Analyzing the Effectiveness of Primary Healthcare in China: A Qualitative Comparative Study Using the TOE Framework.
Proceedings of the 2023 8th International Conference on Intelligent Information Processing, 2023

A qualitative comparative analysis of the causes of patient trust in Chinese public tertiary hospitals from the resource-based perspective.
Proceedings of the 2023 8th International Conference on Intelligent Information Processing, 2023

A High-Order-Temperature-Compensated 328kHz On Chip RC Timer Using Time-Interleaved Resistors Achieving 1.5pJ/Cycle and 5.86ppm°C.
Proceedings of the IEEE Custom Integrated Circuits Conference, 2023

Recurrent Neural Network-Based Fault Diagnosis Method for Multisource Information Fusion of Drilling Pump Power End Gear.
Proceedings of the CAA Symposium on Fault Detection, 2023

2022
A 0.0014 mm<sup>2</sup>, 1.18 TΩ Segmented Duty-Cycled Resistor Replacing Pseudo-Resistor for Neural Recording Interface Circuits.
Proceedings of the IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), 2022

A 260×274 μm<sup>2</sup> 572 nW Neural Recording Micromote Using Near-Infrared Power Transfer and an RF Data Uplink.
Proceedings of the IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), 2022

An Impedance-boosted Switched-capacitor Low-noise Amplifier Achieving 0.4 NEF.
Proceedings of the IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), 2022

A Second-Order Temperature-Compensated On-Chip R-RC Oscillator Achieving 7.93ppm/°C and 3.3pJ/Hz in -40°C to 125°C Temperature Range.
Proceedings of the IEEE International Solid-State Circuits Conference, 2022

An Energy-Efficient Spiking Neural Network for Finger Velocity Decoding for Implantable Brain-Machine Interface.
Proceedings of the 4th IEEE International Conference on Artificial Intelligence Circuits and Systems, 2022

2021
Spatiotemporal Evolution and Trend Prediction of Tourism Economic Vulnerability in China's Major Tourist Cities.
ISPRS Int. J. Geo Inf., 2021

2020
A 8.7ppm/°C, 694nW, One-Point Calibrated RC Oscillator using a Nonlinearity-Aware Dual Phase-Locked Loop and DSM-Controlled Frequency-Locked Loops.
Proceedings of the IEEE Symposium on VLSI Circuits, 2020

Research on Maintenance Strategy of Distribution Network based on Monte Carlo Tree.
Proceedings of the 6th IEEE International Conference on Big Data Security on Cloud, 2020

2019
FPGA Implementation of a Kalman-Based Motion Estimator for Levitated Nanoparticles.
IEEE Trans. Instrum. Meas., 2019


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