Jiatong Liu
Orcid: 0000-0001-9730-7110
According to our database1,
Jiatong Liu
authored at least 16 papers
between 2015 and 2025.
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Bibliography
2025
Exposing the Forgery Clues of DeepFakes via Exploring the Inconsistent Expression Cues.
Int. J. Intell. Syst., 2025
2024
A Bilevel Programming Model for Multi-Satellite Cooperative Observation Mission Planning.
IEEE Access, 2024
Proceedings of the IEEE International Conference on Acoustics, 2024
2023
Wind speed point prediction and interval prediction method based on linear prediction model, neural network, and deep learning.
J. Ambient Intell. Humaniz. Comput., July, 2023
2022
Multiple Granularities Generative Adversarial Network for Recognition of Wafer Map Defects.
IEEE Trans. Ind. Informatics, 2022
2021
Two-Dimensional Principal Component Analysis-Based Convolutional Autoencoder for Wafer Map Defect Detection.
IEEE Trans. Ind. Electron., 2021
Pattern Recognit., 2021
Action recognition for sports video analysis using part-attention spatio-temporal graph convolutional network.
J. Electronic Imaging, 2021
Cross-subject EEG emotion classification based on few-label adversarial domain adaption.
Expert Syst. Appl., 2021
Proceedings of the CONF-CDS 2021: The 2nd International Conference on Computing and Data Science, 2021
FES-RF: A Feature Ensemble Selection Based Random Forest Method For Accurate Cancer Screening.
Proceedings of the IEEE International Conference on Bioinformatics and Biomedicine, 2021
2020
Application of data mining technology and wireless network sensing technology in sports training index analysis.
EURASIP J. Wirel. Commun. Netw., 2020
Spatiotemporal Changes in the Urban Heat Island Intensity of Distinct Local Climate Zones: Case Study of Zhongshan District, Dalian, China.
Complex., 2020
2019
Design and development of sports training system based on image processing technology.
Clust. Comput., 2019
Stacked convolutional sparse denoising auto-encoder for identification of defect patterns in semiconductor wafer map.
Comput. Ind., 2019
2015
Variation of thermal stress in TSV structures caused by crystallinity of electroplated copper interconnections.
Proceedings of the 2015 International 3D Systems Integration Conference, 2015