Jianwei Wang

Orcid: 0000-0002-4028-8198

Affiliations:
  • Beihang University, Beijing, China


According to our database1, Jianwei Wang authored at least 11 papers between 2015 and 2024.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Dataset
Other 

Links

Online presence:

On csauthors.net:

Bibliography

2024
Classification and Location of Cerebral Hemorrhage Points Based on SEM and SSA-GA-BP Neural Network.
IEEE Trans. Instrum. Meas., 2024

2022
A Miniaturized Ultrawideband Active Electric Probe With High Sensitivity for Near-Field Measurement.
IEEE Trans. Instrum. Meas., 2022

2021
Near-Field Precision Measurement System of High-Density Integrated Module.
IEEE Trans. Instrum. Meas., 2021

2020
Ultrawideband Real-Time Monitoring System Based on Electro-Optical Under-Sampling and Data Acquisition for Near-Field Measurement.
IEEE Trans. Instrum. Meas., 2020

An Improved Equivalent Dipole Moment Source Model Based on Regularization Optimization Method for Near Field-Far Field Conversion.
IEEE Access, 2020

2019
Improved-Sensitivity Resonant Electric-Field Probes Based on Planar Spiral Stripline and Rectangular Plate Structure.
IEEE Trans. Instrum. Meas., 2019

A High-Sensitivity Resonant Tangential E-Probe With Loaded Improved Dipole and Embedded Integrated Balun.
IEEE Trans. Instrum. Meas., 2019

A Novel Tangential Electric-Field Sensor Based on Electric Dipole and Integrated Balun for the Near-Field Measurement Covering GPS Band.
Sensors, 2019

2018
Noncontact Wideband Current Probes With High Sensitivity and Spatial Resolution for Noise Location on PCB.
IEEE Trans. Instrum. Meas., 2018

2017
A Miniature Ultrawideband Electric Field Probe Based on Coax-Thru-Hole via Array for Near-Field Measurement.
IEEE Trans. Instrum. Meas., 2017

2015
Research on crosstalk issue of through silicon via for 3D integration.
Proceedings of the 28th IEEE International System-on-Chip Conference, 2015


  Loading...