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Jianfeng Li

Orcid: 0000-0001-5205-5167

Affiliations:
  • University of Nottingham, Department of Electrical and Electronic Engineering, UK


According to our database1, Jianfeng Li authored at least 5 papers between 2011 and 2018.

Collaborative distances:
  • Dijkstra number2 of six.
  • Erdős number3 of five.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
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Links

Online presence:

On csauthors.net:

Bibliography

2018
Comparison of power cycling reliability of flexible PCB interconnect smaller/thinner and larger/thicker power devices with topside Sn-3.5Ag solder joints.
[BibTeX]
[DOI]
Jianfeng Li
,
Jingru Dai
,
Christopher Mark Johnson
Microelectron. Reliab., 2018

2016
A thermal cycling reliability study of ultrasonically bonded copper wires.
[BibTeX]
[DOI]
Elaheh Arjmand
,
Pearl A. Agyakwa
,
Martin R. Corfield
,
Jianfeng Li
,
Bassem Mouawad
,
C. Mark Johnson
Microelectron. Reliab., 2016

2015
Dependence of overcurrent failure modes of IGBT modules on interconnect technologies.
[BibTeX]
[DOI]
Imran Yaqub
,
Jianfeng Li
,
Christopher Mark Johnson
Microelectron. Reliab., 2015

2013
Degradation of thermal interface materials for high-temperature power electronics applications.
[BibTeX]
[DOI]
Robert Skuriat
,
Jianfeng Li
,
Pearl A. Agyakwa
,
Nevil Mattey
,
Paul Evans
,
C. Mark Johnson
Microelectron. Reliab., 2013

2011
Microstructural evolution of ultrasonically bonded high purity Al wire during extended range thermal cycling.
[BibTeX]
[DOI]
Pearl A. Agyakwa
,
Martin R. Corfield
,
Li Yang
,
Jianfeng Li
,
V. M. F. Marques
,
C. Mark Johnson
Microelectron. Reliab., 2011


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