Jianfeng Li
Orcid: 0000-0001-5205-5167Affiliations:
- University of Nottingham, Department of Electrical and Electronic Engineering, UK
According to our database1,
Jianfeng Li
authored at least 5 papers
between 2011 and 2018.
Collaborative distances:
Collaborative distances:
Timeline
2011
2012
2013
2014
2015
2016
2017
2018
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Legend:
Book In proceedings Article PhD thesis Dataset OtherLinks
Online presence:
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on scopus.com
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on orcid.org
On csauthors.net:
Bibliography
2018
Comparison of power cycling reliability of flexible PCB interconnect smaller/thinner and larger/thicker power devices with topside Sn-3.5Ag solder joints.
Microelectron. Reliab., 2018
2016
Microelectron. Reliab., 2016
2015
Dependence of overcurrent failure modes of IGBT modules on interconnect technologies.
Microelectron. Reliab., 2015
2013
Degradation of thermal interface materials for high-temperature power electronics applications.
Microelectron. Reliab., 2013
2011
Microstructural evolution of ultrasonically bonded high purity Al wire during extended range thermal cycling.
Microelectron. Reliab., 2011