Jian-Hsing Lee
Orcid: 0000-0001-5903-6890
According to our database1,
Jian-Hsing Lee
authored at least 23 papers
between 2002 and 2024.
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Bibliography
2024
Negative Triggering Current Induced the Latch-up in the Circuit without the ESD device to Power.
Proceedings of the International Conference on Consumer Electronics - Taiwan, 2024
The Influence of the Block Design on the ID-VD Curves of Power Transistor for E-SOA Characterization.
Proceedings of the International Conference on Consumer Electronics - Taiwan, 2024
2023
A Concise Electrothermal Model to Characterize the Thermal Safe-Operating Area of Power Transistor.
Proceedings of the IEEE International Reliability Physics Symposium, 2023
Proceedings of the International Conference on Consumer Electronics - Taiwan, 2023
Proceedings of the International Conference on Consumer Electronics - Taiwan, 2023
Proceedings of the International Conference on Consumer Electronics - Taiwan, 2023
2022
Incorporation of a Simple ESD Circuit in a 650V E-Mode GaN HEMT for All-Terminal ESD Protection.
Proceedings of the IEEE International Reliability Physics Symposium, 2022
Proceedings of the IEEE International Conference on Consumer Electronics - Taiwan, 2022
Proceedings of the IEEE International Conference on Consumer Electronics - Taiwan, 2022
2021
Study on the Guard Rings for Latchup Prevention between HV-PMOS and LV-PMOS in a 0.15-µm BCD Process.
Proceedings of the IEEE International Reliability Physics Symposium, 2021
Proceedings of the IEEE International Conference on Consumer Electronics-Taiwan, 2021
Proceedings of the IEEE International Conference on Consumer Electronics-Taiwan, 2021
2020
Proceedings of the IEEE International Conference on Consumer Electronics - Taiwan, 2020
Proceedings of the IEEE International Conference on Consumer Electronics - Taiwan, 2020
2019
Proceedings of the IEEE International Reliability Physics Symposium, 2019
Proceedings of the IEEE International Reliability Physics Symposium, 2019
Proceedings of the IEEE International Conference on Consumer Electronics - Taiwan, 2019
2015
Proceedings of the IEEE International Reliability Physics Symposium, 2015
Proceedings of the IEEE International Reliability Physics Symposium, 2015
Enhanced CDM-robustness for the packaged IC with the extra bonding wire to the die-attach plate.
Proceedings of the IEEE International Reliability Physics Symposium, 2015
Proceedings of the IEEE International Reliability Physics Symposium, 2015
2005
A new pre-driver design for improving the ESD performance of the high voltage tolerant I/O.
Proceedings of the International Symposium on Circuits and Systems (ISCAS 2005), 2005
2002
Proceedings of the IEEE 2002 Custom Integrated Circuits Conference, 2002