Jian-Hsing Lee
Orcid: 0000-0001-5903-6890
According to our database1,
Jian-Hsing Lee
authored at least 21 papers
between 2002 and 2023.
Collaborative distances:
Collaborative distances:
Timeline
Legend:
Book In proceedings Article PhD thesis Dataset OtherLinks
On csauthors.net:
Bibliography
2023
A Concise Electrothermal Model to Characterize the Thermal Safe-Operating Area of Power Transistor.
Proceedings of the IEEE International Reliability Physics Symposium, 2023
Proceedings of the International Conference on Consumer Electronics - Taiwan, 2023
Proceedings of the International Conference on Consumer Electronics - Taiwan, 2023
Proceedings of the International Conference on Consumer Electronics - Taiwan, 2023
2022
Incorporation of a Simple ESD Circuit in a 650V E-Mode GaN HEMT for All-Terminal ESD Protection.
Proceedings of the IEEE International Reliability Physics Symposium, 2022
Proceedings of the IEEE International Conference on Consumer Electronics - Taiwan, 2022
Proceedings of the IEEE International Conference on Consumer Electronics - Taiwan, 2022
2021
Study on the Guard Rings for Latchup Prevention between HV-PMOS and LV-PMOS in a 0.15-µm BCD Process.
Proceedings of the IEEE International Reliability Physics Symposium, 2021
Proceedings of the IEEE International Conference on Consumer Electronics-Taiwan, 2021
Proceedings of the IEEE International Conference on Consumer Electronics-Taiwan, 2021
2020
Proceedings of the IEEE International Conference on Consumer Electronics - Taiwan, 2020
Proceedings of the IEEE International Conference on Consumer Electronics - Taiwan, 2020
2019
Proceedings of the IEEE International Reliability Physics Symposium, 2019
Proceedings of the IEEE International Reliability Physics Symposium, 2019
Proceedings of the IEEE International Conference on Consumer Electronics - Taiwan, 2019
2015
Proceedings of the IEEE International Reliability Physics Symposium, 2015
Proceedings of the IEEE International Reliability Physics Symposium, 2015
Enhanced CDM-robustness for the packaged IC with the extra bonding wire to the die-attach plate.
Proceedings of the IEEE International Reliability Physics Symposium, 2015
Proceedings of the IEEE International Reliability Physics Symposium, 2015
2005
A new pre-driver design for improving the ESD performance of the high voltage tolerant I/O.
Proceedings of the International Symposium on Circuits and Systems (ISCAS 2005), 2005
2002
Proceedings of the IEEE 2002 Custom Integrated Circuits Conference, 2002