Jian Gao

Orcid: 0000-0001-5625-7751

Affiliations:
  • Guangdong University of Technology, MOE, Key Laboratory of Precision Microelectronic Manufacturing Technology and Equipment, Guangzhou, China
  • University of Nottingham, School of Materials, Mechanical and Manufacturing Engineering, UK (PhD 2002)


According to our database1, Jian Gao authored at least 39 papers between 2006 and 2024.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

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Bibliography

2024
Design and implementation of a precision levelling composite stage with active passive vibration isolation.
Robotics Comput. Integr. Manuf., 2024

Accurate error compensation method for multi-axis parallel machine via singularized jacobi geometric parameter correction and coupling error evaluation.
Robotics Comput. Integr. Manuf., 2024

2023
A High-Efficiency Searching Time Reduction Method for VCM Soft-Landing Operation During Chip Bonding.
IEEE Trans. Ind. Electron., September, 2023

Fast plane extraction method based on the point pair feature.
Multim. Tools Appl., April, 2023

A Novel Defocus-Degree-Based Phase Unwrapping and Fusion Algorithm for High-Speed and Large-Depth-Range 3D Measurement.
IEEE Trans. Ind. Electron., 2023

2022
Novel Dynamic Microactuation Method for Tracking-Error Reduction of Permanent Magnet Linear Synchronous Motors.
IEEE Trans. Ind. Electron., 2022

Hybrid Position/Force Fully Closed-Loop Control of a Flip-Chip Soft-Landing Bonding System.
IEEE Trans. Ind. Electron., 2022

Development of a Novel Intelligent Adjustable Vision Algorithm for LED Chip Repairing.
IEEE Trans. Ind. Electron., 2022

Development and Testing of a Large-Stroke Nanopositioning Stage With Linear Active Disturbance Rejection Controller.
IEEE Trans Autom. Sci. Eng., 2022

2021
A Fast Self-Correction Method for Nonlinear Sinusoidal Fringe Images in 3-D Measurement.
IEEE Trans. Instrum. Meas., 2021

A VCM Active Actuation Method for Bonding Time Reduction in Chip Packaging Process.
IEEE Trans. Ind. Electron., 2021

A Flip-Chip Alignment System With the Property of Deviation Self-Correction at the Nanoscale.
IEEE Trans. Ind. Electron., 2021

Event-Triggered Adaptive Control Design With Prescribed Performance for Macro-Micro Composite Positioning Stage.
IEEE Trans. Ind. Electron., 2021

Vibratory Feeding Performance Improvement Through Discrete Element Analysis for High-Speed Optical Detection of LED Chips.
IEEE Access, 2021

Extended State Observer-Based IMC-PID Tracking Control of PMLSM Servo Systems.
IEEE Access, 2021

2020
A Novel Self-Feedback Intelligent Vision Measure for Fast and Accurate Alignment in Flip-Chip Packaging.
IEEE Trans. Ind. Informatics, 2020

A fast 3D object recognition algorithm using plane-constrained point pair features.
Multim. Tools Appl., 2020

Rationally Designing the Trace of Wire Bonder Head for Large-Span-Ratio Wire Bonding in 3D Stacked Packaging.
IEEE Access, 2020

2019
A Stable Autoregressive Moving Average Hysteresis Model in Flexure Fast Tool Servo Control.
IEEE Trans Autom. Sci. Eng., 2019

Evaluation Algorithm of Root Canal Shape Based on Steklov Spectrum Analysis.
Comput. Math. Methods Medicine, 2019

Triangular Model Registration Algorithm Through Differential Topological Singularity Points by Helmholtz-Hodge Decomposition.
IEEE Access, 2019

Dynamic Modeling, Simulation, and Experimental Verification of a Wafer Handling SCARA Robot With Decoupling Servo Control.
IEEE Access, 2019

2018
A Rapid Dynamic Positioning Method for Settling Time Reduction Through a Macro-Micro Composite Stage With High Positioning Accuracy.
IEEE Trans. Ind. Electron., 2018

Development and Repetitive-Compensated PID Control of a Nanopositioning Stage With Large-Stroke and Decoupling Property.
IEEE Trans. Ind. Electron., 2018

High Dynamic Control of a Flexure Fast Tool Servo Using On-line Sequential Extreme Learning Machine.
Proceedings of the 2018 IEEE/ASME International Conference on Advanced Intelligent Mechatronics, 2018

2017
A Rapid Vibration Reduction Method for Macro-Micro Composite Precision Positioning Stage.
IEEE Trans. Ind. Electron., 2017

Imbalanced defect classification for mobile phone screen glass using multifractal features and a new sampling method.
Multim. Tools Appl., 2017

Review and Comparison of High-Dynamic Range Three-Dimensional Shape Measurement Techniques.
J. Sensors, 2017

Cutter location path generation through an improved algorithm for machining triangular mesh.
Comput. Aided Des., 2017

Automatic surface defect detection for mobile phone screen glass based on machine vision.
Appl. Soft Comput., 2017

A direct-drive SCARA robot for wafer&ceramic-substrate handling based on visual servoing.
Proceedings of the 2017 IEEE International Conference on Cybernetics and Intelligent Systems (CIS) and IEEE Conference on Robotics, 2017

A regularized on-line sequential extreme learning machine with forgetting property for fast dynamic hysteresis modeling.
Proceedings of the 2017 IEEE/RSJ International Conference on Intelligent Robots and Systems, 2017

A large-stroke flexure fast tool servo with new displacement amplifier.
Proceedings of the IEEE International Conference on Advanced Intelligent Mechatronics, 2017

2016
A new sampling method for classifying imbalanced data based on support vector machine ensemble.
Neurocomputing, 2016

2014
Task Polar Coordinate Frame-Based Contouring Control of Biaxial Systems.
IEEE Trans. Ind. Electron., 2014

2012
Development of OLED Panel Defect Detection System through Improved Otsu Algorithm.
Proceedings of the Intelligent Robotics and Applications - 5th International Conference, 2012

2010
T2: A novel two Degree-of-Freedom translational parallel robot for pick-and-place operation.
Proceedings of the 8th IEEE International Conference on Control and Automation, 2010

2008
Evaluation of a Low-cost Inertial Dynamic Measurement System.
Proceedings of the 2008 IEEE Conference on Robotics, Automation and Mechatronics, 2008

2006
Adaptive restoration of complex geometry parts through reverse engineering application.
Adv. Eng. Softw., 2006


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