Jiajia Li

Orcid: 0000-0002-3420-9764

Affiliations:
  • University of California at San Diego, La Jolla, CA, USA


According to our database1, Jiajia Li authored at least 24 papers between 2013 and 2020.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
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Links

Online presence:

On csauthors.net:

Bibliography

2020
Optimal Generalized H-Tree Topology and Buffering for High-Performance and Low-Power Clock Distribution.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2020

2019
Enhancing sensitivity-based power reduction for an industry IC design context.
Integr., 2019

2018
PROBE: A Placement, Routing, Back-End-of-Line Measurement Utility.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2018

Design Implementation With Noninteger Multiple-Height Cells for Improved Design Quality in Advanced Nodes.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2018

2017
Improved Physical Design and Signoff Methodologies for Better Integrated Circuit Design Quality
PhD thesis, 2017

Logic Design Partitioning for Stacked Power Domains.
IEEE Trans. Very Large Scale Integr. Syst., 2017

Trading Accuracy for Energy in Stochastic Circuit Design.
ACM J. Emerg. Technol. Comput. Syst., 2017

Revisiting 3DIC benefit with multiple tiers.
Integr., 2017

Floorplan and placement methodology for improved energy reduction in stacked power-domain design.
Proceedings of the 22nd Asia and South Pacific Design Automation Conference, 2017

2016
Improved flop tray-based design implementation for power reduction.
Proceedings of the 35th International Conference on Computer-Aided Design, 2016

Measuring progress and value of IC implementation technology.
Proceedings of the 35th International Conference on Computer-Aided Design, 2016

Improved performance of 3DIC implementations through inherent awareness of mix-and-match die stacking.
Proceedings of the 2016 Design, Automation & Test in Europe Conference & Exhibition, 2016

Comprehensive optimization of scan chain timing during late-stage IC implementation.
Proceedings of the 53rd Annual Design Automation Conference, 2016

2015
Optimization of Overdrive Signoff in High-Performance and Low-Power ICs.
IEEE Trans. Very Large Scale Integr. Syst., 2015

An Improved Methodology for Resilient Design Implementation.
ACM Trans. Design Autom. Electr. Syst., 2015

Mixed Cell-Height Implementation for Improved Design Quality in Advanced Nodes.
Proceedings of the IEEE/ACM International Conference on Computer-Aided Design, 2015

Optimizing Stochastic Circuits for Accuracy-Energy Tradeoffs.
Proceedings of the IEEE/ACM International Conference on Computer-Aided Design, 2015

A global-local optimization framework for simultaneous multi-mode multi-corner clock skew variation reduction.
Proceedings of the 52nd Annual Design Automation Conference, 2015

2014
NOLO: A no-loop, predictive useful skew methodology for improved timing in IC implementation.
Proceedings of the Fifteenth International Symposium on Quality Electronic Design, 2014

Horizontal benchmark extension for improved assessment of physical CAD research.
Proceedings of the Great Lakes Symposium on VLSI 2014, GLSVLSI '14, Houston, TX, USA - May 21, 2014

A new methodology for reduced cost of resilience.
Proceedings of the Great Lakes Symposium on VLSI 2014, GLSVLSI '14, Houston, TX, USA - May 21, 2014

2013
Toward quantifying the IC design value of interconnect technology improvements.
Proceedings of the ACM/IEEE International Workshop on System Level Interconnect Prediction, 2013

Reliability-constrained die stacking order in 3DICs under manufacturing variability.
Proceedings of the International Symposium on Quality Electronic Design, 2013

Optimization of overdrive signoff.
Proceedings of the 18th Asia and South Pacific Design Automation Conference, 2013


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