Ji Fan
Orcid: 0000-0001-5774-0059
According to our database1,
Ji Fan
authored at least 16 papers
between 2006 and 2024.
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Bibliography
2024
In Situ Calibration of Binocular Vision System for 3-D Measurement of Particle Size During Crystallization.
IEEE Trans. Instrum. Meas., 2024
Multiaccelerometer-Based Method for High-Precision Angular Acceleration Measurement of Turntable.
IEEE Trans. Instrum. Meas., 2024
Lyapunov-guided Multi-Agent Reinforcement Learning for Delay-Sensitive Wireless Scheduling.
CoRR, 2024
2023
Implementation of Effective Scale Factor Matching and Axial Centripetal Error Compensation for a Rotating Accelerometer Gravity Gradiometer.
IEEE Trans. Instrum. Meas., 2023
Deep Learning-Based Binocular Image Analysis for In Situ Measurement of Particle Length Distribution During Crystallization Process.
IEEE Trans. Instrum. Meas., 2023
In Situ Measurement of 2-D Crystal Size Distribution During Cooling Crystallization Process via a Binocular Telecentric Imaging System.
IEEE Trans. Instrum. Meas., 2023
2022
Mathematic Model and Error Analysis of Moving-Base Rotating Accelerometer Gravity Gradiometer.
IEEE Trans. Aerosp. Electron. Syst., 2022
2021
Cross-Coupling Coefficient Estimation of a Nano-g Accelerometer by Continuous Rotation Modulation on a Tilted Rate Table.
IEEE Trans. Instrum. Meas., 2021
2020
Temperature Gradient Method for Alleviating Bonding-Induced Warpage in a High-Precision Capacitive MEMS Accelerometer.
Sensors, 2020
2018
Study on Misalignment Angle Compensation during Scale Factor Matching for Two Pairs of Accelerometers in a Gravity Gradient Instrument.
Sensors, 2018
2017
High-Sensitivity Encoder-Like Micro Area-Changed Capacitive Transducer for a Nano-g Micro Accelerometer.
Sensors, 2017
Sensors, 2017
2016
Novel Capacitive Sensing System Design of a Microelectromechanical Systems Accelerometer for Gravity Measurement Applications.
Micromachines, 2016
Proceedings of the Computational Science and Its Applications - ICCSA 2016, 2016
2011
3D integration of MEMS and CMOS via Cu-Cu bonding with simultaneous formation of electrical, mechanical and hermetic bonds.
Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011
2006
Proceedings of the 13th IEEE International Conference on Electronics, 2006