Jeyun Yeom

According to our database, Jeyun Yeom authored at least 1 paper in 2018.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2018

Large-area die-attachment by silver stress migration bonding for power device applications.

Seungjun Noh, Hao Zhang, Jeyun Yeom, Chuantong Chen, Caifu Li, Katsuaki Suganuma

Microelectron. Reliab., 2018