Jeroen J. M. Zaal

According to our database, Jeroen J. M. Zaal authored at least 6 papers between 2008 and 2024.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2024

AI-Enabled Board Level Vibration Testing: Unveiling The Physics of Degradation.

Varun Thukral, Chen He, Rebecca Chen, Letian Zhang, Romuald Roucou, Michiel van Soestbergen, Jeroen J. M. Zaal, Rene Rongen, Willem D. van Driel, G. Q. Zhang

Proceedings of the IEEE International Test Conference, 2024

2016

Moisture absorption by molding compounds under extreme conditions: Impact on accelerated reliability tests.

Amar Mavinkurve, Jaume L. M. Llacer Martinez, Michiel van Soestbergen, Jeroen J. M. Zaal

Microelectron. Reliab., 2016

2010

Challenges in the Assembly and Handling of Thin Film Capped MEMS Devices.

Jeroen J. M. Zaal, Willem D. van Driel, G. Q. Zhang

Sensors, 2010

Designing for reliability using a new Wafer Level Package structure.

Hendrik Pieter Hochstenbach, Willem D. van Driel, Dao-Guo Yang, Jeroen J. M. Zaal, E. Bagerman

Microelectron. Reliab., 2010

2009

Solder interconnect reliability under drop impact loading conditions using High-speed Cold Bump Pull.

Jeroen J. M. Zaal, Hendrik Pieter Hochstenbach, Willem D. van Driel, G. Q. Zhang

Microelectron. Reliab., 2009

2008

Packaging influences on the reliability of MEMS resonators.

Jeroen J. M. Zaal, W. D. van Driel, S. Bendida, Q. Li, J. T. M. van Beek, G. Q. Zhang

Microelectron. Reliab., 2008