Jeong-Won Yoon

According to our database, Jeong-Won Yoon authored at least 7 papers between 2006 and 2017.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of five.

2017

Interfacial reactions and mechanical strength of Sn-3.0Ag-0.5Cu/Ni/Cu and Au-20Sn/Ni/Cu solder joints for power electronics applications.

Byung-Suk Lee, Yong-Ho Ko, Jung-Hwan Bang, Chang-Woo Lee, Sehoon Yoo, Jun-Ki Kim, Jeong-Won Yoon

Microelectron. Reliab., 2017

2014

Electrical properties and electrochemical migration characteristics of directly printed Ag patterns with various sintering conditions.

Jeong-Won Yoon, Bo-In Noh, Seung-Boo Jung

Microelectron. Reliab., 2014

2013

Joint reliability evaluation of thermo-compression bonded FPCB/RPCB joints under high temperature storage test.

Jeong-Won Yoon, Min-Kwan Ko, Bo-In Noh, Seung-Boo Jung

Microelectron. Reliab., 2013

2008

Effects of isothermal aging and temperature-humidity treatment of substrate on joint reliability of Sn-3.0Ag-0.5Cu/OSP-finished Cu CSP solder joint.

Jeong-Won Yoon, Bo-In Noh, Young-Ho Lee, Hyo-Soo Lee, Seung-Boo Jung

Microelectron. Reliab., 2008

Mechanical reliability of Sn-rich Au-Sn/Ni flip chip solder joints fabricated by sequential electroplating method.

Jeong-Won Yoon, Hyun-Suk Chun, Bo-In Noh, Ja-Myeong Koo, Jong-Woong Kim, Hoo-Jeong Lee, Seung-Boo Jung

Microelectron. Reliab., 2008

2007

Au-SN Flip-Chip Solder Bump for Microelectronic and Optoelectronic Applications

Jeong-Won Yoon, Hyun-Suk Chun, Ja-Myeong Koo, Seung-Boo Jung

CoRR, 2007

2006

High temperature reliability and interfacial reaction of eutectic Sn-0.7Cu/Ni solder joints during isothermal aging.

Jeong-Won Yoon, Seung-Boo Jung

Microelectron. Reliab., 2006