Jenq-Gong Duh

According to our database, Jenq-Gong Duh authored at least 1 paper in 2015.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of five.

2015

Interfacial reaction and mechanical evaluation in multi-level assembly joints with ENEPIG under bump metallization via drop and high speed impact test.

Hsiu-Min Lin, Cheng-Ying Ho, Wen-Lin Chen, Yi-Hsin Wu, De-Hui Wang, Jun-Ren Lin, Yu-Hui Wu, Huei-Cheng Hong, Zhi-Wei Lin, Jenq-Gong Duh

Microelectron. Reliab., 2015