Jenn-Ming Song

According to our database, Jenn-Ming Song authored at least 5 papers between 2009 and 2024.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2024

Surface Modification for Ultrasonic Cu-to-Cu Direct Bonding.

Chih-Hsien Chiu, Wei-Ting Chen, Jenn-Ming Song

Proceedings of the International 3D Systems Integration Conference, 2024

2015

Power electronics packaging.

Katsuaki Suganuma, Jenn-Ming Song, Yi-Shao Lai

Microelectron. Reliab., 2015

2012

Guest Editorial - Low Temperature Processing for Microelectronics and Microsystems Packaging.

Tadatomo Suga, Jenn-Ming Song, Yi-Shao Lai

Microelectron. Reliab., 2012

Influence of trace alloying elements on the ball impact test reliability of SnAgCu solder joints.

Jenn-Ming Song, Yao-Ren Liu, Yi-Shao Lai, Ying-Ta Chiu, Ning-Cheng Lee

Microelectron. Reliab., 2012

2009

Alloying modification of Sn-Ag-Cu solders by manganese and titanium.

Li-Wei Lin, Jenn-Ming Song, Yi-Shao Lai, Ying-Ta Chiu, Ning-Cheng Lee, Jun-Yen Uan

Microelectron. Reliab., 2009