Jean-Pierre Fradin

According to our database, Jean-Pierre Fradin authored at least 5 papers between 2001 and 2019.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2019

Development of SiC MOSFET Electrical Model and Experimental Validation: Improvement and Reduction of Parameter Number.

Quang Chuc Nguyen, Patrick Tounsi, Jean-Pierre Fradin, Jean-Michel Reynes

Proceedings of the 26th International Conference on Mixed Design of Integrated Circuits and Systems, 2019

Using Compact Thermal Modelling for the Investigation of a Cooling System Dysfunction Applied to a Power Module with Double Sided Cooling.

Anaïs Cassou, Patrick Tounsi, Jean-Pierre Fradin

Proceedings of the 26th International Conference on Mixed Design of Integrated Circuits and Systems, 2019

2007

Virtual reliability assessment of integrated power switches based on multi-domain simulation approach.

Pierre Solomalala, J. Saiz, Michel Mermet-Guyennet, Alberto Castellazzi, Mauro Ciappa, X. Chauffleur, Jean-Pierre Fradin

Microelectron. Reliab., 2007

2005

Innovative Methodology for Predictive Reliability of Intelligent Power Devices Using Extreme Electro-thermal Fatigue.

B. Khong, Patrick Tounsi, Philippe Dupuy, X. Chauffleur, Marc Legros, A. Deram, Colette Levade, G. Vanderschaeve, Jean-Marie Dorkel, Jean-Pierre Fradin

Microelectron. Reliab., 2005

2001

Modeling Thermal Laser Stimulation.

Felix Beaudoin, X. Chauffleur, Jean-Pierre Fradin, Philippe Perdu, Romain Desplats, Dean Lewis

Microelectron. Reliab., 2001