Jean Durupt
According to our database1,
Jean Durupt
authored at least 13 papers
between 1993 and 2021.
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Bibliography
2021
IntAct: A 96-Core Processor With Six Chiplets 3D-Stacked on an Active Interposer With Distributed Interconnects and Integrated Power Management.
IEEE J. Solid State Circuits, 2021
2020
2.3 A 220GOPS 96-Core Processor with 6 Chiplets 3D-Stacked on an Active Interposer Offering 0.6ns/mm Latency, 3Tb/s/mm<sup>2</sup> Inter-Chiplet Interconnects and 156mW/mm<sup>2</sup>@ 82%-Peak-Efficiency DC-DC Converters.
Proceedings of the 2020 IEEE International Solid- State Circuits Conference, 2020
2019
Test Solutions for High Density 3D-IC Interconnects - Focus on SRAM-on-Logic Partitioning.
Proceedings of the 24th IEEE European Test Symposium, 2019
2018
A 29 Gops/Watt 3D-Ready 16-Core Computing Fabric with Scalable Cache Coherent Architecture Using Distributed L2 and Adaptive L3 Caches.
Proceedings of the 44th IEEE European Solid State Circuits Conference, 2018
2016
IJTAG supported 3D DFT using chiplet-footprints for testing multi-chips active interposer system.
Proceedings of the 21th IEEE European Test Symposium, 2016
2009
Design-for-test approach of an asynchronous network-on-chip architecture and its associated test pattern generation and application.
IET Comput. Digit. Tech., 2009
2008
A Design-for-Test Implementation of an Asynchronous Network-on-Chip Architecture and its Associated Test Pattern Generation and Application.
Proceedings of the Second International Symposium on Networks-on-Chips, 2008
Proceedings of the ESSCIRC 2008, 2008
2007
Proceedings of the First International Symposium on Networks-on-Chips, 2007
Proceedings of the 2007 IEEE International Solid-State Circuits Conference, 2007
2006
Proceedings of the 11th European Test Symposium, 2006
Proceedings of the 9th IEEE Workshop on Design & Diagnostics of Electronic Circuits & Systems (DDECS 2006), 2006
1993
Proceedings of the 1993 Euromicro Workshop on Parallel and Distributed Processing, 1993