Jan Vanfleteren
Orcid: 0000-0002-9654-7304
According to our database1,
Jan Vanfleteren
authored at least 22 papers
between 1990 and 2024.
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Bibliography
2024
2022
Sensors, 2022
Proceedings of the Advances in System-Integrated Intelligence, 2022
2021
Fully Integrated Flexible Dielectric Monitoring Sensor System for Real-Time In Situ Prediction of the Degree of Cure and Glass Transition Temperature of an Epoxy Resin.
IEEE Trans. Instrum. Meas., 2021
2019
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2019
2016
RTM Production Monitoring of the A380 Hinge Arm Droop Nose Mechanism: A Multi-Sensor Approach.
Sensors, 2016
Proceedings of the 2016 IEEE SENSORS, Orlando, FL, USA, October 30 - November 3, 2016, 2016
2015
Impact of geometry on stretchable meandered interconnect uniaxial tensile extension fatigue reliability.
Microelectron. Reliab., 2015
2014
Proceedings of the 44th European Solid State Device Research Conference, 2014
2013
Wirel. Pers. Commun., 2013
Reliability of a stretchable interconnect utilizing terminated, in-plane meandered copper conductor.
Microelectron. Reliab., 2013
2012
IEEE Trans. Instrum. Meas., 2012
Stretchable biocompatible electronics by embedding electrical circuitry in biocompatible elastomers.
Proceedings of the Annual International Conference of the IEEE Engineering in Medicine and Biology Society, 2012
2011
Microelectron. Reliab., 2011
In-body path loss models for implants in heterogeneous human tissues using implantable slot dipole conformal flexible antennas.
EURASIP J. Wirel. Commun. Netw., 2011
Ultra-Thin Chip Package (UTCP) and stretchable circuit technologies for wearable ECG system.
Proceedings of the 33rd Annual International Conference of the IEEE Engineering in Medicine and Biology Society, 2011
2009
Displays, 2009
2008
Microelectron. Reliab., 2008
Proceedings of the 8th International Conference on New Interfaces for Musical Expression, 2008
The Musical Synchrotron: Using Wireless Motion Sensors to Study How Social Interaction Affects Synchronization with Musical Tempo.
Proceedings of the 8th International Conference on New Interfaces for Musical Expression, 2008
2003
Comparison of different flex materials in high density flip chip on flex applications.
Microelectron. Reliab., 2003
1990