Jan K. Spelt

According to our database, Jan K. Spelt authored at least 6 papers between 2006 and 2012.

Collaborative distances:

• Dijkstra number of seven.
• Erdős number of six.

2012

Prediction of pad cratering fracture at the copper pad - Printed circuit board interface.

Siva P. V. Nadimpalli, Jan K. Spelt

Microelectron. Reliab., 2012

2008

Effect of primary creep and plasticity in the modeling of thermal fatigue of SnPb and SnAgCu solder joints.

Dwayne R. Shirley, Hamid R. Ghorbani, Jan K. Spelt

Microelectron. Reliab., 2008

Thermal stress concentration factors for defects in plated-through-vias.

O. Belashov, Jan K. Spelt

Microelectron. Reliab., 2008

2007

Comparison of Weibull small samples using Monte Carlo simulations.

Rex Lam, Jan K. Spelt

Qual. Reliab. Eng. Int., 2007

2006

Temperature profile effects in accelerated thermal cycling of SnPb and Pb-free solder joints.

Yan Qi, Rex Lam, Hamid R. Ghorbani, Polina Snugovsky, Jan K. Spelt

Microelectron. Reliab., 2006

Interfacial thermal stresses in solder joints of leadless chip resistors.

Hamid R. Ghorbani, Jan K. Spelt

Microelectron. Reliab., 2006