Jai Hyuk Song
Affiliations:- Samsung, Seoul, South Korea
According to our database1,
Jai Hyuk Song
authored at least 11 papers
between 2020 and 2022.
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Bibliography
2022
A 1Tb 3b/Cell 8th-Generation 3D-NAND Flash Memory with 164MB/s Write Throughput and a 2.4Gb/s Interface.
Proceedings of the IEEE International Solid-State Circuits Conference, 2022
Novel Electrical Detection Method for Random Defects on Peripheral Circuits in NAND Flash Memory.
Proceedings of the IEEE International Reliability Physics Symposium, 2022
Electric Field Impact on Lateral Charge Diffusivity in Charge Trapping 3D NAND Flash Memory.
Proceedings of the IEEE International Reliability Physics Symposium, 2022
Development of 7th generation 3D VNAND Flash Product with COP structure for Growing Demand in Storage Market.
Proceedings of the International Conference on Electronics, Information, and Communication, 2022
Proceedings of the International Conference on Electronics, Information, and Communication, 2022
Proceedings of the International Conference on Electronics, Information, and Communication, 2022
2021
A 1.8-Gb/s/Pin 16-Tb NAND Flash Memory Multi-Chip Package With F-Chip for High-Performance and High-Capacity Storage.
IEEE J. Solid State Circuits, 2021
A 512Gb 3b/Cell 7<sup>th</sup> -Generation 3D-NAND Flash Memory with 184MB/s Write Throughput and 2.0Gb/s Interface.
Proceedings of the IEEE International Solid-State Circuits Conference, 2021
Proceedings of the International Conference on Electronics, Information, and Communication, 2021
A Hybrid ZQ Calibration Design for High-Density Flash Memory Toggle 5.0 High-speed Interface.
Proceedings of the IEEE Asian Solid-State Circuits Conference, 2021
2020
A 1.8 Gb/s/pin 16Tb NAND Flash Memory Multi-Chip Package with F-Chip of Toggle 4.0 Specification for High Performance and High Capacity Storage Systems.
Proceedings of the IEEE Symposium on VLSI Circuits, 2020