Jai Hyuk Song

Affiliations:
  • Samsung, Seoul, South Korea


According to our database1, Jai Hyuk Song authored at least 11 papers between 2020 and 2022.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

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Links

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Bibliography

2022

Novel Electrical Detection Method for Random Defects on Peripheral Circuits in NAND Flash Memory.
Proceedings of the IEEE International Reliability Physics Symposium, 2022

Electric Field Impact on Lateral Charge Diffusivity in Charge Trapping 3D NAND Flash Memory.
Proceedings of the IEEE International Reliability Physics Symposium, 2022

Development of 7th generation 3D VNAND Flash Product with COP structure for Growing Demand in Storage Market.
Proceedings of the International Conference on Electronics, Information, and Communication, 2022

Machine Learning for Product Engineering in NAND Flash Memory.
Proceedings of the International Conference on Electronics, Information, and Communication, 2022

Cell Operation Technologies to Overcome Scale-down Issues in 3D NAND Flash Memory.
Proceedings of the International Conference on Electronics, Information, and Communication, 2022

2021
A 1.8-Gb/s/Pin 16-Tb NAND Flash Memory Multi-Chip Package With F-Chip for High-Performance and High-Capacity Storage.
IEEE J. Solid State Circuits, 2021


Issues and Key Technologies for Next Generation 3D NAND.
Proceedings of the International Conference on Electronics, Information, and Communication, 2021

A Hybrid ZQ Calibration Design for High-Density Flash Memory Toggle 5.0 High-speed Interface.
Proceedings of the IEEE Asian Solid-State Circuits Conference, 2021

2020
A 1.8 Gb/s/pin 16Tb NAND Flash Memory Multi-Chip Package with F-Chip of Toggle 4.0 Specification for High Performance and High Capacity Storage Systems.
Proceedings of the IEEE Symposium on VLSI Circuits, 2020


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