Jaewon Park

Orcid: 0000-0002-5704-726X

According to our database¹, Jaewon Park authored at least 17 papers between 2006 and 2024.

Collaborative distances:

Dijkstra number² of four.
Erdős number³ of four.

Timeline

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In proceedings

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PhD thesis

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On csauthors.net:

Bibliography

2024

A Droplet Screening System for Discovery of Slow-Growing Microbes from Environment Through Long-Term Culture.

[BibT_eX]

[DOI]

Proceedings of the 2024 IEEE SENSORS, Kobe, Japan, October 20-23, 2024, 2024

Vertical GaN FinFET with Small form Factor and High Reliability for Implementation of 6G Communication.

[BibT_eX]

[DOI]

Proceedings of the 15th International Conference on Information and Communication Technology Convergence, 2024

Research of Transferable GaN Wafers Based on 2D Material-Assisted Growth for 6G Communication Devices.

[BibT_eX]

[DOI]

Proceedings of the 15th International Conference on Information and Communication Technology Convergence, 2024

2023

A 16 GB 1024 GB/s HBM3 DRAM With Source-Synchronized Bus Design and On-Die Error Control Scheme for Enhanced RAS Features.

[BibT_eX]

[DOI]

IEEE J. Solid State Circuits, 2023

2022

A 16 GB 1024 GB/s HBM3 DRAM with On-Die Error Control Scheme for Enhanced RAS Features.

[BibT_eX]

[DOI]

Proceedings of the IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), 2022

2021

Optimization of PTFE Coating on PDMS Surfaces for Inhibition of Hydrophobic Molecule Absorption for Increased Optical Detection Sensitivity.

[BibT_eX]

[DOI]

Sensors, 2021

Detection of Particulate Matters with a Field-Portable Microscope Using Side-Illuminated Total Internal Reflection.

[BibT_eX]

[DOI]

Sensors, 2021

A 16-GB 640-GB/s HBM2E DRAM With a Data-Bus Window Extension Technique and a Synergetic On-Die ECC Scheme.

[BibT_eX]

[DOI]

IEEE J. Solid State Circuits, 2021

An In-DRAM BIST for 16 Gb DDR4 DRAM in the 2nd 10-nm-Class DRAM Process.

[BibT_eX]

[DOI]

IEEE Access, 2021

2020

Student Session: Comparative Analysis of Live VM Migration with SGX Enclave.

[BibT_eX]

[DOI]

Proceedings of the 26th IEEE International Conference on Embedded and Real-Time Computing Systems and Applications, 2020

22.1 A 1.1V 16GB 640GB/s HBM2E DRAM with a Data-Bus Window-Extension Technique and a Synergetic On-Die ECC Scheme.

[BibT_eX]

[DOI]

Proceedings of the 2020 IEEE International Solid- State Circuits Conference, 2020

Hints for Memory Optimization of Asylo-based SGX Enclave Applications.

[BibT_eX]

[DOI]

Proceedings of the International Conference on Information and Communication Technology Convergence, 2020

2018

A Three-Dimensional Arrayed Microfluidic Blood-Brain Barrier Model With Integrated Electrical Sensor Array.

[BibT_eX]

[DOI]

IEEE Trans. Biomed. Eng., 2018

2016

A Microchip for High-Throughput Axon Growth Drug Screening.

[BibT_eX]

[DOI]

Micromachines, 2016

2014

Evaluation of Large-Sized LCD Touch Panel Using Differential Sensing Circuit and Algorithm.

[BibT_eX]

[DOI]

IEICE Trans. Inf. Syst., 2014

2006

Outage Probability Analysis for DS-CDMA Systems with Call Admission Control Scheme.

[BibT_eX]

[DOI]

Shiquan Piao

Jaewon Park

Yongwan Park

IEICE Trans. Commun., 2006

Parallel Interference Cancellation Scheme Based on Sorting Method for a Multi-Carrier DS/CDMA System.

[BibT_eX]

[DOI]

Jaewon Park

Shiquan Piao

Yongwan Park

IEICE Trans. Commun., 2006

Jaewon Park

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