Jae Hak Lee

According to our database, Jae Hak Lee authored at least 5 papers between 2008 and 2013.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2013

High reliability insert-bump bonding process for 3D integration.

Jun-Yeob Song, Jae Hak Lee, Hyoung Joon Kim, Chang Woo Lee, Tae Ho Ha

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

A study on wafer level TSV build-up integration method.

Jae Hak Lee, Hyoung Joon Kim, Jun-Yeob Song, Chang Woo Lee, Tae Ho Ha

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

2011

A study on the edge traces technique for 3D stack chip.

Jae Hak Lee, Choong D. Yoo, Jun-Yeob Song, Seung S. Lee, Sun-Rak Kim

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

2010

Robust CCD and IR Image Registration Using Gradient-Based Statistical Information.

Jae Hak Lee, Yong Sun Kim, Duhgoon Lee, Dong-Goo Kang, Jong Beom Ra

IEEE Signal Process. Lett., 2010

2008

Multi-sensor image registration based on intensity and edge orientation information.

Yong Sun Kim, Jae Hak Lee, Jong Beom Ra

Pattern Recognit., 2008