Jacob Botimer

According to our database, Jacob Botimer authored at least 6 papers between 2019 and 2024.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2024

Arvon: A Heterogeneous System-in-Package Integrating FPGA and DSP Chiplets for Versatile Workload Acceleration.

Wei Tang, Sung-Gun Cho, Tim Tri Hoang, Jacob Botimer, Wei Qiang Zhu, Ching-Chi Chang, Cheng-Hsun Lu, Junkang Zhu, Yaoyu Tao, Tianyu Wei, Naomi Kavi Motwani, Mani Yalamanchi, Ramya Yarlagadda, Sirisha Rani Kale, Mark Flanigan, Allen Chan, Thungoc Tran, Sergey Y. Shumarayev, Zhengya Zhang

IEEE J. Solid State Circuits, April, 2024

2023

Arvon: A Heterogeneous SiP Integrating a 14nm FPGA and Two 22nm 1.8TFLOPS/W DSPs with 1.7Tbps/mm² AIB 2.0 Interface to Provide Versatile Workload Acceleration.

Wei Tang, Sung-Gun Cho, Tim Tri Hoang, Jacob Botimer, Wei Qiang Zhu, Ching-Chi Chang, Cheng-Hsun Lu, Junkang Zhu, Yaoyu Tao, Tianyu Wei, Naomi Kavi Motwani, Mani Yalamanchi, Ramya Yarlagadda, Sirisha Kale, Mark Flannigan, Allen Chan, Thungoc Tran, Sergey Y. Shumarayev, Zhengya Zhang

Proceedings of the 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2023

2021

A 256Gb/s/mm-shoreline AIB-Compatible 16nm FinFET CMOS Chiplet for 2.5D Integration with Stratix 10 FPGA on EMIB and Tiling on Silicon Interposer.

Chester Liu, Jacob Botimer, Zhengya Zhang

Proceedings of the IEEE Custom Integrated Circuits Conference, 2021

2020

A 1.87-mm² 56.9-GOPS Accelerator for Solving Partial Differential Equations.

Thomas Chen, Jacob Botimer, Teyuh Chou, Zhengya Zhang

IEEE J. Solid State Circuits, 2020

2019

CASCADE: Connecting RRAMs to Extend Analog Dataflow In An End-To-End In-Memory Processing Paradigm.

Teyuh Chou, Wei Tang, Jacob Botimer, Zhengya Zhang

Proceedings of the 52nd Annual IEEE/ACM International Symposium on Microarchitecture, 2019

An Sram-Based Accelerator for Solving Partial Differential Equations.

Thomas Chen, Jacob Botimer, Teyuh Chou, Zhengya Zhang

Proceedings of the IEEE Custom Integrated Circuits Conference, 2019