Ja-Myeong Koo

According to our database¹, Ja-Myeong Koo authored at least 4 papers between 2007 and 2008.

Collaborative distances:

Dijkstra number² of six.
Erdős number³ of six.

Timeline

Legend:

Book

In proceedings

Article

PhD thesis

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On csauthors.net:

Bibliography

2008

Mechanical reliability of Sn-rich Au-Sn/Ni flip chip solder joints fabricated by sequential electroplating method.

[BibT_eX]

[DOI]

Microelectron. Reliab., 2008

2007

Effect of displacement rate on ball shear properties for Sn-37Pb and Sn-3.5Ag BGA solder joints during isothermal aging.

[BibT_eX]

[DOI]

Ja-Myeong Koo

Seung-Boo Jung

Microelectron. Reliab., 2007

Au-SN Flip-Chip Solder Bump for Microelectronic and Optoelectronic Applications

[BibT_eX]

[DOI]

CoRR, 2007

Effect of Surface Finish of Substrate on Mechanical Reliability of in-48SN Solder Joints in Moems Package

[BibT_eX]

[DOI]

Ja-Myeong Koo

Seung-Boo Jung

CoRR, 2007

Ja-Myeong Koo

Timeline

Legend:

Links

On csauthors.net:

Bibliography

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