J. Yaung

According to our database, J. Yaung authored at least 3 papers between 2022 and 2024.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2024

Integration of Si-Interposer and High Density MIM Capacitor on 2.5D Foveros Face-to-Face Architecture.

Christopher Pelto, R. Aggarwal, R. Ahan, M. Armstrong, M. Bebek, M. Blount, S. Chowdhury, J. Chuah, C. Connor, T. DeBonis, B. Dhayal, A. Dougless, S. Gokhale, A. Jain, V. Javvaji, K. Kamisetty, G. Kim, J. Kpetehoto, C. Kuan, C. Lin, G. Liu, Y. Ma, G. Mcpherson, S. Mokler, Christopher Perini, R. Ramaswamy, Bernhard Sell, R. Subramaniam, James Waldemer, D. Wei, Y. Yang, Y. Yang, J. Yaung, B. Sabi, S. Natarajan

Proceedings of the IEEE Symposium on VLSI Technology and Circuits 2024, 2024

An Intel 3 Advanced FinFET Platform Technology for High Performance Computing and SOC Product Applications.

Walid M. Hafez, D. Abanulo, M. Abdelkader, S. An, C. Auth, D. Bahr, V. Balakrishnan, R. Bambery, M. Beck, M. Bhargava, S. Bhowmick, J. Biggs-houck, J. Birdsall, D. Caselli, H.-Y. Chang, Y. Chang, R. Chaudhuri, S. Chauhan, C. Chen, V. Chikarmane, K. Chikkadi, T. Chu, C. Connor, R. De Alba, Y. Deng, C. Destefano, D. Diana, Y. Dong, P. Elfick, Tyler Elko-Hansen, B. Fallahazad, Y. Fang, D. Gala, D. Garg, C. Geppert, S. Govindaraju, W. Grimm, H. Grunes, L. Guler, Z. Guo, A. Gupta, M. Hattendorf, S. Havelia, J. Hazra, A. Islam, A. Jain, S. Jaloviar, M. Jamil, M. Jang, M. Kabir, J. Kameswaran, Eric Karl, S. Kelgeri, A. Kennedy, C. Kilroy, J. Kim, Y. Kim, D. Krishnan, G. Lee, H.-P. Lee, Q. Li, H. Lin, A. Luk, Y. Luo, P. Macfarlane, A. Mamun, K. Marla, D. Mayeri, E. Mckenna, A. Miah, K. Mistry, M. Mleczko, S. Moon, D. Nardi, S. Natarajan, J. Nathawat, C. Nolph, C. Nugroho, P. Nyhus, A. Oni, P. Packan, D. Pak, A. Paliwal, R. Pandey, I. Paredes, K. Park, L. Paulson, A. Pierre, P. Plekhanov, C. Prasad, R. Ramaswamy, J. Riley, Johann Rode, R. Russell, S. Ryu, H. Saavedra, T. Salisbury, Justin Sandford, F. Shah, K. Shang, P. Shekhar, A. Shu, E. Skoug, J. Sohn, J. Song, M. Sprinkle, J. Su, A. Tan, T. Troeger, R. Tsao, A. Vaidya, C. Wallace, X. Wang, H. Wang, C. Ward, S. Wickramaratne, M. Wills, T. Wu, Z. Xia-hua, S. Xu, P. Yashar, J. Yaung, Y. Yu, M. Zilm, Bernhard Sell

Proceedings of the IEEE Symposium on VLSI Technology and Circuits 2024, 2024

2022

Intel 4 CMOS Technology Featuring Advanced FinFET Transistors optimized for High Density and High-Performance Computing.

Bernhard Sell, S. An, J. Armstrong, D. Bahr, B. Bains, R. Bambery, K. Bang, D. Basu, S. Bendapudi, D. Bergstrom, R. Bhandavat, S. Bhowmick, M. Buehler, D. Caselli, S. Cekli, Vrsk. Chaganti, Y. J. Chang, K. Chikkadi, T. Chu, T. Crimmins, G. Darby, C. Ege, P. Elfick, Tyler Elko-Hansen, S. Fang, C. Gaddam, M. Ghoneim, H. Gomez, S. Govindaraju, Z. Guo, Walid M. Hafez, M. Haran, M. Hattendorf, S. Hu, A. Jain, S. Jaloviar, M. Jang, J. Kameswaran, V. Kapinus, A. Kennedy, S. Klopcic, D. Krishnan, J. Leib, Y.-T. Lin, N. Lindert, G. Liu, O. Loh, Y. Luo, S. Mani, M. Mleczko, S. Mocherla, P. Packan, M. Paik, A. Paliwal, R. Pandey, K. Patankar, L. Pipes, P. Plekhanov, Chetan Prasad, M. Prince, G. Ramalingam, R. Ramaswamy, J. Riley, J. R. Sanchez Perez, Justin Sandford, A. Sathe, F. Shah, H. Shim, S. Subramanian, S. Tandon, M. Tanniru, D. Thakurta, T. Troeger, X. Wang, C. Ward, A. Welsh, S. Wickramaratne, J. Wnuk, S. Q. Xu, P. Yashar, J. Yaung, K. Yoon, N. Young

Proceedings of the IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), 2022