J. W. Wan

According to our database, J. W. Wan authored at least 3 papers between 2005 and 2008.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2008

Experimental verification of models for underfill flow driven by capillary forces in flip-chip packaging.

J. W. Wan, Wen-Jun Zhang, D. J. Bergstrom

Microelectron. Reliab., 2008

2007

Recent advances in modeling the underfill process in flip-chip packaging.

J. W. Wan, Wen-Jun Zhang, D. J. Bergstrom

Microelectron. J., 2007

2005

Influence of transient flow and solder bump resistance on underfill process.

J. W. Wan, Wen-Jun Zhang, D. J. Bergstrom

Microelectron. J., 2005